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Yamakawa Kimio

Dow Corning

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Publication

Featured researches published by Yamakawa Kimio.

Archive | 1997

Curable epoxy resin compositions and electronic components

Mine Katsutoshi; Takeuchi Takae; Yamakawa Kimio

Archive | 2006

Paste-like silver composition, method for producing same, method for producing solid silver, solid silver, bonding method, and method for manufacturing circuit board

Yamakawa Kimio; Mine Katsutoshi

Archive | 2006

Pasty metal particle composition, method of hardening pasty metal particle composition, method of bonding metal member, process for producing printed wiring board

Yamakawa Kimio; Mine Katsutoshi

Archive | 2009

THERMOELECTRIC CONVERSION MODULE AND PROCESS FOR PRODUCING THE SAME

Inamori Futoshi; Fujii Kazuhiro; Mine Katsutoshi; Yamakawa Kimio

Archive | 2007

Pasty metal particle composition and method of joining

Mine Katsutoshi; Yamakawa Kimio; Asami Hidetomo; Takahashi Nobuhiro; Maeda Yuko

Archive | 1999

SHEET-LIKE HOT-MELT ADHESIVE AND SEMICONDUCTOR

Yamakawa Kimio; Isshiki Minoru; Otani Yoshiko; Mine Katsutoshi

Archive | 1998

Curable silicone composition and method for manufacturing electrical parts

Isshiki Minoru; Mine Katsutoshi; Yamakawa Kimio

Archive | 1997

Organopolysiloxane composition for impregnating electronic components and electronic components impregnated therewith

Ishiki Minoru; Mine Katsutoshi; Takeuchi Takae; Yamakawa Kimio

Archive | 1996

PURIFICATION OF ORGANOPOLYSILOXANE

Yamakawa Kimio; Ishikawa Takae; Mine Katsutoshi

Archive | 2007

Sintering metal particle composition having plasticity, method of producing the same, bonding agent and bonding method

Mine Katsutoshi; Yamakawa Kimio; Asami Hidetomo; Takahashi Nobuhiro; Maeda Yuko

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Collaboration

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Mine Katsutoshi

Dow Corning

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Isshiki Minoru

Dow Corning

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Nakayoshi Kazumi

Dow Corning

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Kasuya Akira

Dow Corning

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Kato Tomoko

Dow Corning

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Takeuchi Takae

Dow Corning

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Shima Ryoto

Dow Corning

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Naito Hiroyoshi

Dow Corning

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Ushio Yoshito

Dow Corning

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Ishikawa Hiroki

Dow Corning

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