Yaocheng Zhang

Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints

The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Qc under different temperatures of solder joints were obtained by an empirical equation. The results reveal that the microstructure of the composite solder joint is refined and the tensile creep resistance is improved by CNTs. The improvement of creep behavior is due to the microstructural change of the composite solder joints, since the CNTs could provide more obstacles for dislocation pile-up, which enhances the values of the stress exponent and the creep activation energy. The steady-state tensile creep rates of plain solder and composite solder joints are increased with increasing temperature and applied stress. The tensile creep constitutive equations of plain solder and composite solder joints are written as

Sensitivity of Liquation Cracking to Deposition Parameters and Residual Stresses in Laser Deposited IN718 Alloy

\dot{\varepsilon }_{s1} = 14.94\left( {\sigma /G} \right)^{3.7} \exp \left( { - \frac{81444}{RT}} \right)

Effect of Ca and Sr on the compressive creep behavior of Mg–4Al–RE based magnesium alloys

ε˙s1=14.94σ/G3.7exp-81444RT and

Grain growth of Ni-based superalloy IN718 coating fabricated by pulsed laser deposition

\dot{\varepsilon }_{s2} = 2.5\left( {\sigma /G} \right)^{4.38} \exp \left( { - \frac{101582}{RT}} \right)

Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

ε˙s2=2.5σ/G4.38exp-101582RT, respectively. The tensile creep mechanism of the solder joints is the effects of lattice diffusion determined by dislocation climbing.

Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

ABSTRACT The effect of Mo nanoparticles on the microstructure, wettability and mechanical properties of Sn–58Bi–xMo (x = 0–2.00) solder joints was investigated. The results showed that the optimal wettability of Sn–58Bi–0.25Mo solder was obtained and the microstructure was refined by adding small amounts of Mo. The intermetallic compounds (IMCs) thickness was increased from Sn–58Bi 2.17 µm to Sn–58Bi–2Mo 2.73 µm. The tensile strength of Sn–58Bi solder joint was improved by adding 0.25 wt-% Mo. The fracture mode of Sn–58Bi solder joint and Sn–58Bi–0.25Mo solder joint was brittle fracture and the mixed mode was ductile failure and brittle fracture, respectively. The microstructure of Sn–58Bi and Sn–58Bi–0.25Mo solder joints was coarsened, IMCs thickness was increased and the mechanical properties were deteriorated with increasing aging time.