Yasufumi Uchida

Semiconductor device having multi-chip package

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Semiconductor device having a die pad structure for preventing cracks in a molding resin

Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same

Method for selectively providing adhesive on a semiconductor device

Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same

Semiconductor device having first and second chips

Multi-chip package semiconductor device having plural level interconnections

Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor

Semiconductor device with shock absorbing bond pad