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Yasufumi Uchida

Oki Electric Industry

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Publication

Featured researches published by Yasufumi Uchida.

Archive | 2002

Semiconductor device having multi-chip package

Yasufumi Uchida

Archive | 2004

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Yasufumi Uchida; Yoshihiro Saeki

Archive | 1996

Semiconductor device having a die pad structure for preventing cracks in a molding resin

Shigeru Yamada; Yasufumi Uchida; Noriko Murakami; Yoshinori Shizuno

Archive | 1996

Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same

Shigeru Yamada; Yasufumi Uchida; Noriko Murakami; Yoshinori Shizuno

Archive | 2003

Method for selectively providing adhesive on a semiconductor device

Yasufumi Uchida

Archive | 1996

Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same

Shigeru Yamada; Yasufumi Uchida; Noriko Murakami; Yoshinori Shizuno

Archive | 2002

Semiconductor device having first and second chips

Yasufumi Uchida

Archive | 2004

Multi-chip package semiconductor device having plural level interconnections

Yasufumi Uchida

Archive | 2000

Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor

Shigeru Yamada; Yasufumi Uchida; Noriko Murakami; Yoshinori Shizuno

Archive | 2003

Semiconductor device with shock absorbing bond pad

Yasufumi Uchida

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Collaboration

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Noriko Murakami

Oki Electric Industry

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Shigeru Yamada

Oki Electric Industry

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Yoshinori Shizuno

Oki Electric Industry

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Yoshihiro Saeki

Oki Electric Industry

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