Yasushi Kawasumi

Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head

Semiconductor device made using processing from both sides of a workpiece

Method of treating active material

Method of producing a through-hole and the use of said method to produce a silicon substrate having a through-hole or a device using such a substrate, method of producing an ink jet print head and use of said method for producing an ink jet print head

Method of making a semiconductor device using processing from both sides of a workpiece

Chemical vapor deposition method and apparatus making use of liquid starting material

Method for forming a thin film using a gas

Thin film formation on semiconductor wafer

Method of forming a contact pad by selective deposition of a metal film.

Verfahren und Vorrichtung zur chemischen Dampfabscheidung Method and apparatus for chemical vapor deposition