Yoshiaki Yamade
Sumitomo Metal Industries
Publication
Featured researches published by Yoshiaki Yamade.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B | 1998
Yoichi Moriya; Yoshiaki Yamade; Ryuji Shinya
The intermetallic compound layer between Pb-Sn solder and Ag-Pd conductor after aging at 150 °C has been studied. Elemental and phase distributions of this layer has been probed using SEM, EPMA and EDX. The investigation of the microstructure of the layer with EPMA liner analysis reveals segregation of Ag-rich and Pd-rich phases Quantitative EDX analysis results show that the Ag-rich phase contains Ag and Sn with the Ag/Sn ratio around 3/1, and the Pd-rich phase Pd and Sn with the Pd/Sn ratio around 1/4. These phases are confirmed to be the intermetallic compounds Ag3Sn and PdSn4, respectively.
Archive | 1996
Junzo Fukuta; Koji Shibata; Nozomi Tanifuji; Masaya Hashimoto; Yoshiaki Yamade; Hidenori Kataura
Archive | 2000
Masaya Hashimoto; Yoshiaki Yamade; Toshishige Yamamoto; Yoshiki Yamanishi; 善章 山出; 利重 山本; 良樹 山西; 昌也 橋本
Archive | 1998
Yoshitaka Morioka; Motoyuki Obara; Yoshiaki Yamade; 基之 小原; 善章 山出; 善隆 森岡
Archive | 1995
Yoichi Moriya; Yoshiaki Yamade; Koichi Uno
Archive | 1995
Yoichi Moriya; Yoshiaki Yamade; 要一 守屋; 善章 山出
Archive | 1997
Yoichi Moriya; Ichiro Uchiyama; Yoshiaki Yamade; 一郎 内山; 要一 守屋; 善章 山出
Archive | 1997
Yoichi Moriya; Ichiro Uchiyama; Yoshiaki Yamade; 一郎 内山; 要一 守屋; 善章 山出
Archive | 1999
Tadahisa Arahori; Kazuhiko Kusunoki; Yoshiaki Yamade; 善章 山出; 一彦 楠; 忠久 荒堀
Archive | 2006
Yasuto Higashida; Junko Imamura; Yoshio Taruya; Yoshiaki Yamade; 淳子 今村; 善章 山出; 泰斗 東田; 芳男 樽谷
