Yoshihisa Sechi
Osaka University
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Yoshihisa Sechi.
Science and Technology of Welding and Joining | 2014
Kimiaki Nagatsuka; Yoshihisa Sechi; Ninshu Ma; Kazuhiro Nakata
Abstract To investigate the mechanism of the occurrence of the microcracks produced in laser brazing of silicon carbide and cemented carbide using a silver–copper–titanium alloy as the filler metal, a numerical simulation for thermal cycle and thermal stress was performed using the finite element method. The laser-irradiated area of the cemented carbide was heated selectively, and almost uniform temperature distribution in the filler metal was obtained. The tensile thermal stress in the silicon carbide appeared near the interface between the silicon carbide and the filler metal, and the maximum principle stress at about 400 K during the cooling process reached the fracture strength of the silicon carbide. This resulted in the formation of microcracks in the silicon carbide which was observed in the experiment.
Science and Technology of Welding and Joining | 2014
Kimiaki Nagatsuka; S. Yoshida; Yoshihisa Sechi; Kazuhiro Nakata
Abstract Laser brazing was carried out for dissimilar joining of sialon and a WC–Co alloy. Eutectic type Ag–Cu alloys as filler metals with different Ti content ranging from 0 to 2·8 mass-% were used to investigate the effects of Ti on the interface structure and strength of the joint. The filler metal sheet was sandwiched between a sialon block and a WC–Co alloy plate, and a laser beam was irradiated selectively on the WC–Co alloy plate. The brazed joint was obtained using the filler metal containing >0·3 mass-%Ti. TiN, Ti5Si3, and Cu4Ti layers were formed at the interface of sialon and brazed metal as compound layers. The shear strength of the brazed joint increased with increasing Ti content in the filler metal in the range 0·3–1·7 mass-%, reaching a maximum value of 106 MPa. However, the strength decreased when the Ti content became higher than 1·7 mass-%.
Journal of Physics: Conference Series | 2012
Kimiaki Nagatsuka; Yoshihisa Sechi; Kazuhiro Nakata
SiC and WC-Co alloys were joined by laser brazing with an active braze metal. The braze metal based on eutectic Ag-Cu alloy with additional Ti as an active element ranging from 0 to 2.8 mass% was sandwiched by the SiC block and WC-Co alloy plate. The brazing was carried out by selective laser beam irradiation on the WC-Co alloy plate. The content of Ti in the braze metal was required to exceed 0.6 mass% in order to form a brazed joint with a measurable shear strength. The shear strength increased with increasing Ti content up to 2.3 mass%Ti and decreased with a higher content.
IOP Conference Series: Materials Science and Engineering | 2014
Yoshihisa Sechi; Kimiaki Nagatsuka; Kazuhiro Nakata
Laser brazing with Ti as an active element in silver-copper alloy braze metal has been carried out for binder-less cubic boron nitride and tungsten carbide, using silver-copper- titanium braze alloys with titanium content that varied between 0.28 mass% and 1.68 mass%. Observations of the interface using electron probe microanalysis and scanning acoustic microscopy show that efficient interface adhesion between binder-less cubic boron nitride and the silver-copper-titanium braze alloy was achieved for the braze with a titanium content of 0. 28 mass%.
Materials & Design | 2010
Yoshihisa Sechi; Takuya Tsumura; Kazuhiro Nakata
Materials Science and Engineering B-advanced Functional Solid-state Materials | 2012
Kimiaki Nagatsuka; Yoshihisa Sechi; Yoshinari Miyamoto; Kazuhiro Nakata
Materials Transactions | 2009
Yoshihisa Sechi; Akio Takezaki; Taihei Matsumoto; Takuya Tsumura; Kazuhiro Nakata
Transactions of JWRI | 2010
Yoshihisa Sechi; Kazuhiro Nakata
Characterization and Control of Interfaces for high quality advanced materials III | 2010
Yoshihisa Sechi; Taihei Matsumoto; Kazuhiro Nakata
Quarterly Journal of The Japan Welding Society | 2016
Yoshihisa Sechi; Kimiaki Nagatsuka; Kazuhiro Nakata