Yoshiie Matsumoto

Direct bonding of polymer to glass wafers using surface activated bonding (SAB) method at room temperature

The room temperature bonding of PEN film to PEN film, PET film to PET film and PEN film to non-alkali glass was performed by the modified SAB method. No void is observed at the bonding interface with the optimized condition.

Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method

The temporary bonding of polyimide (PI) films and glass substrates is a key technology for realizing flexible devices with thin-film transistors (TFTs). In this paper, we report the surface activated bonding (SAB) method using Si intermediate layers and its bonding and debonding mechanisms after heating. The bonding interface composed of Si and Fe shows a higher bond strength than the interface of only Si, while the bond strengths of both interfaces decrease with post bonding heating. It is also clarified by composition analysis on the debonded surfaces and cross-sectional observation of the bonding interface that the bond strength depends on the toughness of the intermediated layers and PI. The SAB method using Si intermediate layers is found to be applicable to the bonding and debonding of PI and glass.