Yoshiyuki Uchinono

Laser structuring method for MID (LAMP2002)

For the increasing demand of miniaturizing electro-optical devices, Molded Interconnect Device (MID) technology has been taken interest in recent year. MID is a three-dimensional molded component on which electronic circuitry is directly fabricated. The laser structuring process on MID includes the process of forming a copper thin film on a molded component and directly removing only the contour of the circuit using a laser beam. Forming a uniform copper thin film, the laser beam diameter can be made small enough to produce fine patterns with a 50/50 micrometers track/gap combination. This method also simplifies the process by eliminating the need for the photo-resist and mask required in conventional photo imaging processes. The combination of laser wavelength and molded material is carefully selected in consider of absorption characteristic. By controlling the first pulse and designing a circuit for avoiding field concentration during plating, the molded component is successfully processed without any damages. Using this method, the world’s smallest human detection sensor, “NaPiOn” has been developed.