Youichirou Kaga

Fabrication of elongated α-SiAlON via a reaction-bonding process

Circuit board and semiconductor module using this, production method for circuit board

Silicon nitride substrate, process for producing the same, and silicon nitride wiring board and semiconductor module using the same

Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module

SILICON NITRIDE BOARD, METHOD FOR MANUFACTURING THE SILICON NITRIDE BOARD, AND SILICON NITRIDE CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SILICON NITRIDE BOARD

Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

Effect of the amount of excess oxides on the densification of α-SiAlON fabricated via a reaction-bonding process

Silicon nitride substrate and method for manufacturing silicon nitride substrate

Silicon nitride sintered body, method of producing the same, and silicon nitride circuit substrate and semiconductor module using the same