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Young Suk Chung

Amkor Technology

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Publication

Featured researches published by Young Suk Chung.

Archive | 2002

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Jae Hak Yee; Young Suk Chung; Jae Jin Lee; Terry W. Davis; Chung Suk Han; Jae Hun Ku; Jae Sung Kwak; Sang Hyun Ryu

Archive | 2001

Semiconductor package including stacked chips with aligned input/output pads

Seong Min Seo; Young Suk Chung; Jong Sik Paek; Jae Hun Ku; Jae Hak Yee

Archive | 2006

Leadframe and semiconductor package made using the leadframe

Byung Hoon Ahn; Jae Hun Ku; Young Suk Chung; Suk Gu Ko; Sung Sik Jang; Young Nam Choi; Won Chul Do

Archive | 2000

Semiconductor device having increased moisture path and increased solder joint strength

Young Suk Chung; Sung Sik Jang; Jae Jin Lee; Tae Heon Lee; Hyung Ju Lee; Jung Woo Lee; Mu Hwan Seo; Jae Hak Yee; Ku Sun Hong

Archive | 2009

Wafer level chip size package having redistribution layers

No Sun Park; Young Suk Chung; Jae Beom Shim

Archive | 2000

Leadframe for semiconductor package and mold for molding the same

Young Suk Chung; Hyung Ju Lee; Jae Hak Yee

Archive | 2000

Semiconductor package leadframe assembly and method of manufacture

Young Suk Chung; Sung Sik Jang; Jae Hak Yee

Archive | 2000

Clamp and heat block assembly for wire bonding a semiconductor package assembly

Young Suk Chung; Soo Jung Park

Archive | 2008

Semiconductor device having improved contact interface reliability and method therefor

Young Suk Chung; Jae Yoon Kim; Tae Yong Lee

Archive | 2000

Leadframe and semiconductor package with improved solder joint strength

Tae Heon Lee; Young Suk Chung; Mu Hwan Seo

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Collaboration

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Jae Hak Yee

Amkor Technology

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Jae Hun Ku

Amkor Technology

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Jae Jin Lee

Amkor Technology

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Sung Sik Jang

Amkor Technology

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Chung Suk Han

Amkor Technology

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Hyung Ju Lee

Amkor Technology

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Jae Sung Kwak

Amkor Technology

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Jong Sik Paek

Amkor Technology

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Mu Hwan Seo

Amkor Technology

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Sang Hyun Ryu

Amkor Technology

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