Younjin Cho

Polymer-bound photobase generators and photoacid generators for pitch division lithography

The semiconductor industry is pursuing several process options that provide pathways to printing images smaller than the theoretical resolution limit of 193 nm projection scanners. These processes include double patterning, side wall deposition and pitch division. Pitch doubling lithography (PDL), the achievement of pitch division by addition of a photobase generator (PBG) to typical 193 nm resist formulations was recently presented.1 Controlling the net acid concentration as a function of dose by incorporating both a photoacid generator (PAG) and a PBG in the resist formulation imparts a resist dissolution rate response modulation at twice the frequency of the aerial image. Simulation and patterning of 45 nm half pitch L/S patterns produced using a 90 nm half pitch mask were reported.2 Pitch division was achieved, but the line edge roughness of the resulting images did not meet the current standard. To reduce line edge roughness, polymer bound PBGs and polymer bound PAGs were investigated in the PDL resist formulations. The synthesis, purification, analysis, and functional performance of various polymers containing PBG or PAG monomers are described herein. Both polymer bound PBG with monomeric PAG and polymer bound PAG with monomeric PBG showed a PDL response. The performance of the polymer bound formulations is compared to the same formulations with small molecule analogs of PAG and PBG.

Photobase generator enabled pitch division: a progress report

Pitch division lithography (PDL) with a photobase generator (PBG) allows printing of grating images with twice the pitch of a mask. The proof-of-concept has been published in the previous paper and demonstrated by others. Forty five nm half-pitch (HP) patterns were produced using a 90nm HP mask, but the image had line edge roughness (LER) that does not meet requirements. Efforts have been made to understand and improve the LER in this process. Challenges were summarized toward low LER and good performing pitch division. Simulations and analysis showed the necessity for an optical image that is uniform in the z direction in order for pitch division to be successful. Two-stage PBGs were designed for enhancement of resist chemical contrast. New pitch division resists with polymer-bound PAGs and PBGs, and various PBGs were tested. This paper focuses on analysis of the LER problems and efforts to improve patterning performance in pitch division lithography.

Photobase generator assisted pitch division

The drive to sustain the improvements in productivity that derive from following Moores law has led the semiconductor industry to explore new technologies that enable production of smaller and smaller features on semiconductor device. Pitch division techniques and double exposure lithography are approaches that print features beyond the fundamental resolution limit of state-of-art lenses by modifying the lithographic process. This paper presents a new technique that enables pitch division in the printing of gratings using only a single exposure that is fully compatible with the current manufacturing tools. This technique employs a classical photoresist polymer together with a photoactive system that incorporates both a photoacid generator (PAG) and a photobase generator (PBG). The PBG is added to the resist formulation in higher molar concentration than the PAG, but has a base production rate that is slower than the acid production rate of the PAG. The PBG functions as a dose-dependent base quencher, which neutralizes the acid in high dose exposure regions but not in the low dose regions. This photoactive system can be exploited in the design of both positive tone and negative tone resist formulations that provide a developed image of a grating that is twice the frequency of the grating on the mask. A simulation of this process was performed for a 52 nm line and space pattern using PROLITH and customized codes. The results showed generation of a 26 nm half pitch relief image after development. Through this new technique, a 45 nm half pitch line and space pattern was experimentally achieved with a mask that produces a 90 nm half pitch aerial image. This corresponds to a k1 factor of 0.13. The principles, the materials design and the first lithographic evaluations of this system are reported.

Fundamental study of optical threshold layer approach towards double exposure lithography

193 immersion lithography has reached its maximal achievable resolution. There are mainly two lithographic strategies that will enable continued increase in resolution. Those are being pursued in parallel. The first is extreme ultraviolet (EUV) lithography and the second is double patterning (exposure) lithography. EUV lithography is counted on to be available in 2013 time frame for 22 nm node. Unfortunately, this technology has suffered several delays due to fundamental problems with source power, mask infrastructure, metrology and overall reliability. The implementation of EUV lithography in the next five years is unlikely due to economic factors. Double patterning lithography (DPL) is a technology that has been implemented by the industry and has already shown the proof of concept for the 22nm node. This technique while expensive is the only current path forward for scaling with no fundamental showstoppers for the 32nm and 22nm nodes. Double exposure lithography (DEL) is being proposed as a cost mitigating approach to advanced lithography. Compared to DPL, DEL offers advantages in overlay and process time, thus reducing the cost-of-ownership (CoO). However, DEL requires new materials that have a non-linear photoresponse. So far, several approaches were proposed for double exposure lithography, from which Optical Threshold Layer (OTL) was found to give the best lithography performance according to the results of the simulation. This paper details the principle of the OTL approach. A photochromic polymer was designed and synthesized. The feasibility of the material for application of DEL was explored by a series of evaluations.

Decreasing curing temperature of spin-on dielectrics by using additives

Spin-on dielectric (SOD) is widely used in semiconductor industry, to form insulating layers including shallow trench isolation (STI) or inter-layer dielectrics (ILD). SOD has several advantages over high density plasma chemical vapor deposition (HDP-CVD) for manufacturing process, such as less defect and higher throughput. However, both SOD and HDP-CVD have a drawback, which is a high temperature curing process required to make pure silicon oxide layers. High temperature curing could cause high stress and thermal distortion. These disadvantages are becoming more problematic as the semiconductor device shrinks. To resolve the problem, we tested several additives to moderate the curing temperature. It was found out that amine compounds were effective to convert SOD polymer into silicon oxide, therefore the curing process could be performed at a lower temperature. We also observed that the SOD films containing amine additives have higher etch resistance during a wet etch process. These results, as well as the lower curing temperature, are beneficial for manufacturing insulating layers. Further investigation is ongoing to characterize other film properties of the SOD with additives, and to optimize the formulation conditions according to the requirements of manufacturing processes.