Yu-Hsiang Huang

Intrinsic p-type ZnO films fabricated by atmospheric pressure metal organic chemical vapor deposition

The structural, electrical, and optical properties of ZnO films fabricated by atmospheric pressure metal organic chemical vapor deposition (AP-MOCVD) under various gas flow ratios of [H2O]/[DEZn] (VI/II ratio) ranging from 0.55 to 2.74 were systematically examined. Hall effect measurements exhibited an evident effect of the VI/II ratio on the conduction type of the intrinsic films. An n-type film was fabricated at the VI/II ratio=0.55; however, p-type ZnO films with the hole concentration of the order of 1017 cm−3 could be achieved at VI/II ratios higher than 1.0. In particular, the highest mobility of 91.6 cm2/V s and the lowest resistivity of 0.369 Ω cm have been achieved for the specimen fabricated at the VI/II ratio=1.10. Moreover, room-temperature photoluminescence (PL) measurements demonstrated an interstitial Zn (Zni) donor defect related emission at 2.9 eV for the n-type film, while a Zn vacancy (VZn) acceptor defect related one at 3.09 eV for the p-type films. The existence of material intrinsic ...

Characterizations of Ga-doped ZnO films on Si (111) prepared by atmospheric pressure metal-organic chemical vapor deposition

Gallium-doped ZnO films were grown on p-Si(111) substrates by atmospheric pressure metal-organic chemical vapor deposition (AP-MOCVD) using diethylzinc and water as reactant gases and triethyl gallium (TEG) as a n-type dopant gas. The structural, electrical, and optical properties of ZnO:Ga films obtained by varying the flow rate of TEG from 0.56to3.35μmol∕min were examined. X-ray diffraction patterns and scanning electron microscopy images indicated that Ga doping plays a role in forming microstructures in ZnO films. A flat surface with a predominant orientation (101) was obtained for the ZnO:Ga film fabricated at a flow rate of TEG=2.79μmol∕min. This film also revealed a lowest resistivity of 4.54×10−4Ωcm, as measured using the van der Pauw method. Moreover, low temperature photoluminescence (PL) emission recorded at 12K demonstrated the Burstein Moss shift of PL line from 3.365to3.403eV and a line broadening from 100to165meV as the TEG flow rate varied from 0.56to2.79μmol∕min. This blueshift behavior o...

Luminescence mechanisms of silicon-rich nitride films fabricated by atmospheric pressure chemical vapor deposition in N2 and H2 atmospheres

This work examines possible luminescence mechanisms of silicon-rich nitride (SRN) films that were fabricated by atmospheric pressure chemical vapor deposition (APCVD). Under an ambient gas of either H2 or N2, two SRN films were deposited using the same precursors of Si and N. While photoluminescence (PL) measurements of both as-deposited specimens revealed an intense luminescence band (1.8–3.8 eV), which was observable by the naked eye, a detailed examination of the high energy band of the PL spectra over 2.8 eV yielded different results for those samples that were fabricated in different ambiences. To determine the reason for these differences, Fourier-transform infrared spectroscopy and x-ray photoelectron spectroscopy were conducted, suggesting unique chemical bonds and elemental ratio of nitrogen to silicon in SRN films. Further analysis involving plan-view high-resolution transmission electron microscopic observations of SRN films demonstrated the embedding of Si quantum dots (Si QDs), but with some ...

Growth of InN on Si (111) by atmospheric-pressure metal-organic chemical vapor deposition using InN/AlN double-buffer layers

Indium nitride (InN) epilayers have been successfully grown on Si (111) substrates with low-temperature (450°C) grown InN and high-temperature (1050°C) grown AlN (InN∕AlN) double-buffer layers by atmospheric-pressure metal-organic chemical vapor deposition (AP-MOCVD). X-ray diffraction characterizations indicated that highly (0001)-oriented hexagonal InN was grown on Si (111) substrate. Photoluminescence (PL) analyses performed at room temperature showed a strong emission at 0.72eV with a full width at half maximum of 121meV. Excitation intensity dependent measurements demonstrated the PL mechanism to be the band-to-band transition. Time-resolved PL could be fitted by a single exponential exhibiting an ordered film and a recombination lifetime of around 0.85ns. In particular, transmission electron microscopy characterizations indicated that the use of AlN first buffer is very important to achieve a structurally uniform (0001)-oriented InN epilayer on Si (111) by AP-MOCVD.

Fabrication of Whitely Luminescent Silicon-Rich Nitride Films by Atmospheric Pressure Chemical Vapor Deposition

Silicon-rich nitride (SRN) films that can exhibit an intense white-light emission were fabricated by atmospheric pressure chemical vapor deposition. SRN films were deposited on Si substrates using gaseous SiH2Cl2 (DCS) and NH3 as the source materials for Si and N, respectively. The deposition temperature was kept at 850 °C, and H2 was used as the carrier gas with its flow rate modulated to maintain chamber pressure at 1 atm during the deposition. The optical properties of films obtained at various deposition times from 15 to 60 min were examined by photoluminescence (PL) measurement. An intense luminescence band (1.5–3.5 eV) was observed by the naked eye for all as-deposited samples. Besides, time-resolved PL exhibited a short radiative lifetime of about 1 ns for SRN films. Moreover, high resolution plan-view transmission electron microscopy demonstrated the existence of Si dots in SRN films with the dot sizes ranging from 2 to 6 nm and a dot density of about 4×1012/cm2. On the basis of the results obtained, we considered that the related luminescence mechanism for SRN films is connected to crystalline Si dots produced therein.

Luminescence Mechanism of SiOx Films Grown by Atmospheric-Pressure Halide Chemical Vapor Deposition

Strong red-light luminescence was exhibited by nonstoichiometric silicon oxide (SiOx) films grown by atmospheric-pressure halide chemical vapor deposition. The temperature-dependent photoluminescence (PL) measurements and theoretical calculation of emission energy demonstrated that the PL of our samples originated from the energy level of the interface between Si quantum dots (Si-QDs) and a SiO2 matrix. Moreover, the continuous-wave PL spectra showed that the PL intensity can be enhanced by thermal annealing in CO2 environment. The radiative lifetime determined from the time-resolved PL measurement was increased by increasing CO2 thermal annealing temperature. The high-resolution transmission electron microscopy showed single-crystalline Si-QDs embedded in the SiOx films. According to the results obtained, the emission peak of the PL spectra of the SiOx films was probably due to the energy level of the interface region transition, and the nonradiative centers (or dangling bond, defect center) can be passivated using CO2 thermal annealing.