Yu-Long Jiang

Atomic layer deposition of TiO2 from tetrakis-dimethyl-amido titanium or Ti isopropoxide precursors and H2O

Atomic layer deposition (ALD) of TiO2 thin films using Ti isopropoxide and tetrakis-dimethyl-amido titanium (TDMAT) as two kinds of Ti precursors and water as another reactant was investigated. TiO2 films with high purity can be grown in a self-limited ALD growth mode by using either Ti isopropoxide or TDMAT as Ti precursors. Different growth behaviors as a function of deposition temperature were observed. A typical growth rate curve-increased growth rate per cycle (GPC) with increasing temperatures was observed for the TiO2 film deposited by Ti isopropoxide and H2O, while surprisingly high GPC was observed at low temperatures for the TiO2 film deposited by TDMAT and H2O. An energetic model was proposed to explain the different growth behaviors with different precursors. Density functional theory (DFT) calculation was made. The GPC in the low temperature region is determined by the reaction energy barrier. From the experimental results and DFT calculation, we found that the intermediate product stability ...

Germanium surface passivation and atomic layer deposition of high-k dielectrics?a tutorial review on Ge-based MOS capacitors

Due to its high intrinsic mobility, germanium (Ge) is a promising candidate as a channel material (offering a mobility gain of approximately??2 for electrons and??4 for holes when compared to conventional Si channels). However, many issues still need to be addressed before Ge can be implemented in high-performance field-effect-transistor (FET) devices. One of the key issues is to provide a high-quality interfacial layer, which does not lead to substantial drive current degradation in both low equivalent oxide thickness and short channel regime. In recent years, a wide range of materials and processes have been investigated to obtain proper interfacial properties, including different methods for Ge surface passivation, various high-k dielectrics and metal gate materials and deposition methods, and different post-deposition annealing treatments. It is observed that each process step can significantly affect the overall metal?oxide?semiconductor (MOS)-FET device performance. In this review, we describe and compare combinations of the most commonly used Ge surface passivation methods (e.g. epi-Si passivation, surface oxidation and/or nitridation, and S-passivation) with various high-k dielectrics. In particular, plasma-based processes for surface passivation in combination with plasma-enhanced atomic layer deposition for high-k depositions are shown to result in high-quality MOS structures. To further improve properties, the gate stack can be annealed after deposition. The effects of annealing temperature and ambient on the electrical properties of the MOS structure are also discussed.

Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition

cSCK-CEN, Boeretang 200, B-2400 Mol, Belgium Atomic layer deposition ALD of TiO2 films from tetrakisdimethylamido titanium TDMAT or titanium tetraisopropoxide TTIP precursors was investigated. The growth kinetics, chemical composition, and crystallization behavior of the TiO2 films were compared for combinations of the two precursors with three different sources of oxygen thermal ALD using H2O and plasma-enhanced ALD PEALD using H2 Oo r O 2 plasma. For TDMAT, the growth rate per cycle GPC decreased with increasing temperature; while for TTIP with either water plasma or O2 plasma, a relatively constant growth rate per cycle was observed as a function of substrate temperature. It was found that the crystallization temperature of the TiO2 films depends both on film thickness and on the deposition conditions. A correlation was observed between the TiO2 crystallization temperature and the C impurity concentration in the film. The TiO2 films grown using a H2O plasma exhibit the lowest crystallization temperature and have no detectable C impurities. In situ X-ray diffraction measurements were used to test the diffusion barrier properties of the TiO2 layers and proved that all TiO2 films grown using either H2 Oo r O2 plasma are dense and continuous.

The effect of postannealing on the electrical properties of well-aligned n-ZnO nanorods/p-Si heterojunction

This work investigates the effects of postannealing on the electrical properties of the n-ZnO nanorods/p-Si heterojunction. Well-aligned ZnO nanorods are grown on the p-Si substrate with a ZnO seed layer through a hydrothermal method. The as-grown ZnO nanorods are grown along the preferential [0001] direction with high single crystalline quality. The rectifying characteristics of the heterojunction are effectively improved and the rectification ratio is increased tens of times after annealing in air. The leakage current is decreased by two orders of magnitude and the forward-bias injection efficiency is largely enhanced after annealing. The photoluminescence and x-ray photoelectron spectroscopy results show that annealing in the air ambient can effectively reduce the loosely adsorbed oxygen on the surface of the ZnO nanorods so that the bound free electrons can be released, which can result in larger carrier concentration and improve the injection efficiency of the n-ZnO nanorods/p-Si structure in the for...

Ni/Si solid phase reaction studied by temperature-dependent current-voltage technique

The temperature-dependent current–voltage (I–V–T) technique has been used to study the Ni/Si solid phase reaction by measuring the Schottky barrier height (SBH) inhomogeneity of Ni-silicide/Si Schottky diodes. The experimental results show the strong dependence of SBH inhomogeneity on the Ni/Si solid phase reaction. The SBH distribution of the diodes annealed at 500 and 600 °C can be described by a single-Gaussian function and the diode annealed at 500 °C is found to have the best homogeneity and the smallest leakage current. The SBH distribution of the diodes annealed at 400, 700, and 800 °C can be described by a double-Gaussian function in which the mean value of the second Gaussian function is substantially smaller than that of the dominant Gaussian function. The variation of SBH inhomogeneity, an interface property, is related to the phase evolution process in the Ni/Si solid phase reaction, and verified by reverse I–V measurements. Our results indicate that the I–V–T technique may be developed as a w...

Ultrathin GeOxNy interlayer formed by in situ NH3 plasma pretreatment for passivation of germanium metal-oxide-semiconductor devices

In situ NH3 plasma surface-nitridation treatments at 250 °C on both p- and n-type Ge(100) wafers were investigated. An ultrathin high quality GeOxNy interlayer was formed and exhibited dielectric breakdown for electric fields greater than 15 MV/cm. Well behaved capacitance-voltage characteristics were obtained for the complementary metal-oxide-semiconductor capacitors (CMOSCAPs) with HfO2(3 nm)/GeOxNy(1 nm) gate stacks. Gate leakage current density was below 5×10−7 A/cm2 at VFB±1 V for both MOSCAPs with an equivalent oxide thickness of 1.1 nm. Promising electrical properties of the CMOSCAPs indicate effective passivation of the Ge interface with GeOxNy interlayer formed by in situ NH3 plasma treatment.

Electrically active defects in Ni?Si silicide studied by deep-level transient spectroscopy

Deep-level defects are introduced into silicon when nickel silicide is formed by rapid thermal annealing (RTA). Experimental results show that the deep-level defects are mainly related to Ni diffusion from the surface. Diffusion coefficients of the defects in Si at the temperature of 400 °C are calculated. The concentration of the deep-level defects varies with RTA temperature and the deep-level defects disappear at the annealing temperature above 500 °C. The current–voltage (I–V) measurements show that the reverse leakage current is increased by the deep-level defects.

Polarization fatigue in ferroelectric vinylidene fluoride and trifluoroethylene copolymer thin films

In recent years polarization fatigue in ferroelectric polymers has attracted much attention due to their potential use in nonvolatile memories, though the mechanism is still an open question. Here we mainly focus on the experimental observations on two physical phenomena occurring during fatigue process: The frequency dependence of the fatigue rate and the change in the coercive field with increased fatigue cycles. The frequency dependence of fatigue rate shows that at lower fatigue frequencies the rate obeys a universal scaling behavior with respect to N/f, where N is the fatigue cycles and f is the fatigue frequency, while at much higher frequencies this scaling behavior is broken and the fatigue rate is N/f dependent. In addition, both the increase and the decrease of the coercive field are observed, which indicates that the change in the coercive field should be dominated by different mechanisms. Based on the understanding of the crucial influence of space charges on electrical fatigue, we give a deta...

Fabrication of electrically bistable organic semiconducting/ferroelectric blend films by temperature controlled spin coating.

Organic semiconducting/ferroelectric blend films attracted much attention due to their electrical bistability and rectification properties and thereof the potential in resistive memory devices. During film deposition from the blend solution, spinodal decomposition induced phase separation, resulting in discrete semiconducting phase whose electrical property could be modulated by the continuous ferroelectric phase. However, blend films processed by common spin coating method showed extremely rough surfaces, even comparable to the film thickness, which caused large electrical leakage and thus compromised the resistive switching performance. To improve film roughness and thus increase the productivity of these resistive devices, we developed temperature controlled spin coating technique to carefully adjust the phase separation process. Here we reported our experimental results from the blend films of ferroelectric poly(vinylidene fluoride-trifluoroethylene (P(VDF-TrFE)) and semiconducting poly(3-hexylthiophene) (P3HT). We conducted a series of experiments at various deposition temperatures ranging from 20 to 90 °C. The resulting films were characterized by AFM, SEM, and VPFM to determine their structure and roughness. Film roughness first decreased and then increased with the increase of deposition temperature. Electrical performance was also characterized and obviously improved insulating property was obtained from the films deposited between 50 and 70 °C. By temperature control during film deposition, it is convenient to efficiently fabricate ferroelectric/semiconducting blend films with good electrical bistability.

Growth of pinhole-free ytterbium silicide film by solid-state reaction on Si(001) with a thin amorphous Si interlayer

A thin amorphous Si (α‐Si) interlayer is produced between the sputtering deposited ytterbium layer and Si(001) substrate, and the growth of the ytterbium silicide (YbSi2−x) film is investigated in this paper. Formation of YbSi2−x was verified by x-ray diffraction (XRD). The silicide film morphology was examined by scanning electron microscopy (SEM) and atomic force microscopy (AFM). SEM results reveal that without the α‐Si interlayer, pinholes form during YbSi2−x formation on Si(001). Furthermore, the XRD results demonstrate that there is a strong epitaxial relationship between the formed YbSi2−x and Si(001) substrate, and it is believed to be the reason for the formation of pinholes. To suppress the formation of pinholes, a thin α‐Si interlayer with different thicknesses is introduced on the Si(001) substrate prior to Yb film deposition. The α‐Si interlayer is produced by either sputter deposition employing a Si target or by Si ion implantation induced amorphization. In the presence of this thin α‐Si int...