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Yuan-Chang Su

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Publication

Featured researches published by Yuan-Chang Su.

Archive | 2014

Semiconductor package with single sided substrate design and manufacturing methods thereof

Yuan-Chang Su; Shih-Fu Huang; Chia-Cheng Chen; Tzu-Hui Chen; Kuang-Hsiung Chen; Pao-Ming Hsieh; Ming Chiang Lee; Bernd K. Appelt

Archive | 2010

Embedded component substrate and manufacturing methods thereof

Yuan-Chang Su; Shih-Fu Huang; Ming-Chiang Lee; Chien-Hao Wang

Archive | 2010

Embedded component device and manufacturing methods thereof

Chun-Che Lee; Yuan-Chang Su; Ming Chiang Lee; Shih-Fu Huang

Archive | 2010

Semiconductor package and process for fabricating same

Yuan-Chang Su; Shih-Fu Huang; Chia-Cheng Chen; Chia-Hsiung Hsieh; Tzu-Hui Chen; Kuang-Hsiung Chen; Pao-Ming Hsieh

Archive | 2016

Package carrier, semiconductor package, and process for fabricating same

Yuan-Chang Su; Shih-Fu Huang; Chia-Cheng Chen

Archive | 2010

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Shih-Fu Huang; Yuan-Chang Su; Chia-Cheng Chen; Ta-Chun Lee; Kuang-Hsiung Chen

Archive | 2010

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Shih-Fu Huang; Yuan-Chang Su; Chia-Cheng Chen; Kuang-Hsiung Chen; Ming-Chiang Lee; Bernd K. Appelt; Chia-Hsiung Hsieh

Archive | 2008

METHOD OF FABRICATING MULTI-LAYERED SUBSTRATE AND THE SUBSTRATE THEREOF

Bernd Karl Appelt; Yuan-Chang Su; Ming-Chiang Lee; You-Lung Yen

Archive | 2011

Package carrier, package structure, and process for fabricating same

Yuan-Chang Su; Shih-Fu Huang; Chia-Cheng Chen

Archive | 2010

Embedded component package structure

Yuan-Chang Su; Shih-Fu Huang; Bernd Karl Appelt; Ming-Chiang Lee

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Collaboration

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