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Featured researches published by Yukihiro Kiuchi.


Journal of Materials Science: Materials in Electronics | 2001

Self-extinguishing epoxy molding compound with no flame-retarding additives for electronic components

Masatoshi Iji; Yukihiro Kiuchi

A self-extinguishing epoxy molding compound that does not have any flame-retarding additives, such as halogen compounds, has been developed for electronic components. This compound enables the overcoming of environmental issues posed by these flame-retarding additives when compounds containing such additives are burned and disposed of. The molding compound contains phenol aralkyl-type epoxy resin and hardener, both of which include a specific multi-aromatic moiety (biphenylene) in novolac resin structure. The compound extinguished itself after ignition because it formed a stable foam layer on the resin surface during the ignition due to the low elasticity at high temperatures and high pyrolysis resistance of the compound after curing. The foam layer effectively retarded the transfer of heat to the inside during the ignition. Adding silica filler to the molding compound resulted in the synergistic effectiveness of the compound for flame resistance because it increased the foam-layer stability during burning. The molding compound showed other excellent characteristics, including moldability, water resistance, and package reliability. In fact, its resistance to soldering heat, humidity, and high-temperature storage was much better than that of current high-quality epoxy molding compounds containing halogen-type flame-retarding additives.


Journal of Materials Science: Materials in Electronics | 2004

Flame resistant glass-epoxy printed wiring boards with no halogen or phosphorus compounds

Masatoshi Iji; Yukihiro Kiuchi

A highly flame-resistant glass-epoxy laminate-type printed wiring board (PWB) that does not contain such flame-retarding additives as halogen compounds and phosphorus compounds has been developed to overcome environmental problems caused by these flame-retarding additives. The PWB contains a self-extinguishing epoxy resin compound (phenol aralkyl type) and a limited amount of harmless metal hydroxide (aluminum hydroxide). It has high flame-resistance with no inclusion of halogen or phosphorus compounds and shows other good characteristics, including resistance to solder heating and chemical agents in processing, electronic properties, and moldability, which make it a practical FR-4 board. These good characteristics were obtained by utilizing the epoxy resin compounds superior properties, including its pyrolysis resistant, hydrophobicity and non-polar properties, and by minimizing the amount of metal hydroxide. The board is very safe when burned, disposed of, and reused as a filler after pulverizing.


international symposium on environmentally conscious design and inverse manufacturing | 1999

New environmentally conscious flame-retarding plastics for electronics products

Masatoshi Iji; Shin Serizawa; Yukihiro Kiuchi

Flame-retardant plastics containing no toxic flame-retarding additives such as halogen (bromine) compounds and phosphorus compounds have been developed for electronic products. A polycarbonate (PC) resin containing a silicone derivative as a new safer flame-retarding aromatic has been developed for use in housings. A special silicone with a branched chain structure and with an aromatic group in the chain was found to be greatly effective in retarding the combustion of PC resin. The PC resin containing the silicone shows other good properties, such as strength, moldability and heat resistance as well as high flame retardance and also good recyclability. Moreover, the authors have developed a new flame-retardant epoxy resin compound containing no flame-retarding additives as a molding resin for electronic parts. A self-extinguishing network structure of the epoxy resin compound was obtained by using an aromatic epoxy resin and a phenol derivative hardener; both of which have multi-aromatic groups in their main chain. The high flame retardance was achieved by the formation of a foam layer during combustion. The epoxy resin compound has other good properties (resistance to humidity, solder heating and thermal cycles, etc.) as well as high flame retardance and can be used as a high quality molding resin for LSIs.


international symposium on environmentally conscious design and inverse manufacturing | 2001

Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts

Yukihiro Kiuchi; Masatoshi Iji

We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds consist mainly of phenol-aralkyl-type epoxy resins and hardeners; stable foam layers retard heat transfer and thus have self extinguishing properties. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand higher temperatures required for lead-free soldering. The PWB also contains a limited amount of safe metal hydroxide.


Archive | 1998

Epoxy resin composition and semiconductor device using the same

Shinichi Iwasaki; Masatoshi Iji; Yukihiro Kiuchi


Archive | 2007

Aliphatic polyester resin composition and process for producing the same

Shukichi Tanaka; Yukihiro Kiuchi; Masatoshi Iji


Polymers for Advanced Technologies | 2001

Flame‐retardant epoxy resin compounds containing novolac derivatives with aromatic compounds

Masatoshi Iji; Yukihiro Kiuchi


Archive | 2000

Flame-retardant epoxy resin composition and laminate made with the same

Yukihiro Kiuchi; Masatoshi Iji


Polymers for Advanced Technologies | 2003

Flame retardancy and heat resistance of phenol‐biphenylene‐type epoxy resin compound modified with benzoguanamine

Masatoshi Iji; Yukihiro Kiuchi; Makoto Soyama


Archive | 1998

Epoxy resin composition and semiconductor device encupsulated therewith

Masatoshi Iji; Shinichi Iwasaki; Yukihiro Kiuchi

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