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Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Yumi Maruyama is active.

Publication


Featured researches published by Yumi Maruyama.


Archive | 2006

Wafer product and processing method therefor

Yumi Maruyama; Muneo Tamura; Tetsuo Fujii; Hirotsugu Funato


Archive | 2006

MANUFACTURING METHOD OF SEMI-CONDUCTOR APPARATUS

Tetsuo Fujii; Yumi Maruyama; Kazuhiro Osone; Hirotaka Yamashita; Kenichi Yokoyama; ユミ 丸山; 一弘 大曽根; 宏隆 山下; 賢一 横山; 哲夫 藤井


Archive | 2006

Semiconductor device and dicing method for semiconductor substrate

Atsushi Komura; Muneo Tamura; Kazuhiko Sugiura; Hirotsugu Funato; Yumi Maruyama; Tetsuo Fujii; Kenji Kohno


Archive | 2006

Dicing method for semiconductor substrate

Atsushi Komura; Muneo Tamura; Kazuhiko Sugiura; Hirotsugu Funato; Yumi Maruyama; Tetsuo Fujii; Kenji Kohno


Archive | 2007

Cap attachment structure, semiconductor sensor device and method

Kazuhiko Sugiura; Hirotsugu Funato; Tetsuo Fujii; Yumi Maruyama


Archive | 2006

COVER CAP ATTACHMENT STRUCTURE

Tetsuo Fujii; Suketsugu Funato; Yumi Maruyama; Kazuhiko Sugiura; ユミ 丸山; 和彦 杉浦; 祐嗣 舩戸; 哲夫 藤井


Archive | 2006

Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same

Yumi Maruyama; Makoto Asai


Archive | 2006

Halbleitervorrichtung und Verfahren zum Schneiden eines Halbleitersubstrats

Atsushi Komura; Muneo Tamura; Kazuhiko Sugiura; Hirotsugu Funato; Yumi Maruyama; Tetsuo Fujii; Kenji Kohno


Archive | 2007

Waferprodukt und Herstellungsverfahren dafür

Yumi Maruyama; Muneo Tamura; Tetsuo Fujii; Hirotsugu Funato


Archive | 2006

Verbindungsverfahren für ein Halbleitersubstrat und eine Schicht, sowie Herstellungsverfahren von Halbleiterchips unter Verwendung hiervon

Makoto Asai; Yumi Maruyama

Collaboration


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