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Yunzhu Ma

Central South University

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Publication

Featured researches published by Yunzhu Ma.

Materials Characterization | 2013

Microstructure and mechanical properties of diffusion bonded W/steel joint using V/Ni composite interlayer

Wensheng Liu; Qingshan Cai; Yunzhu Ma; Yan Wang; H.Y. Liu; D.X. Li

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2016

Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C

Wensheng Liu; Yikai Wang; Yunzhu Ma; Qiang Yu; Yufeng Huang

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2014

Indentation size effect and micromechanics characterization of intermetallic compounds in the Au–Sn system

Yikai Wang; Wensheng Liu; Yunzhu Ma; Yufeng Huang; Ya Tang; Fan Cheng; Qiang Yu

Materials Letters | 2014

Indentation size effect of stress exponent and hardness in homogeneous duplex eutectic 80Au/20Sn

Wensheng Liu; Yikai Wang; Yunzhu Ma; Yufeng Huang; Ya Tang; Fan Cheng

Archive | 2008

Preparation of micron/nano-scale high purity tungsten powder

Yunzhu Ma; Wensheng Liu; Boyun Huang

Materials Letters | 2014

Indentation depth dependent micromechanical properties and rate dependent pop-in events of (Au,Cu)5Sn

Yikai Wang; Wensheng Liu; Yunzhu Ma; Yufeng Huang; Ya Tang; Huiting Luo; Qiang Yu

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2016

Influence of cumulative strain on microstructure and mechanical properties of multi-directional forged 2A14 aluminum alloy

Ming Wang; Lanping Huang; Wensheng Liu; Yunzhu Ma; Boyun Huang

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2016

Nanoindentation study on micromechanical behaviors of Au–Ni–Sn intermetallic layers in Au–20Sn/Ni solder joints

Wensheng Liu; Yikai Wang; Yunzhu Ma; Qiang Yu; Yufeng Huang

Journal of Materials Science: Materials in Electronics | 2017

Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging

Yunzhu Ma; Tong Wu; Wensheng Liu; Yufeng Huang; Siwei Tang; Yikai Wang

Journal of Materials Science: Materials in Electronics | 2016

Interfacial reaction mechanism and kinetics between Au–20Sn and Sn

Wensheng Liu; Yikai Wang; Yunzhu Ma; Yufeng Huang; Qiang Yu

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Wensheng Liu

Central South University

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Yufeng Huang

Central South University

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Yikai Wang

Central South University

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Qiang Yu

Central South University

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Boyun Huang

Central South University

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Juan Wang

Central South University

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Siwei Tang

Central South University

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Huiting Luo

Central South University

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Qingshan Cai

Central South University

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Xiaolei Song

Central South University

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