Yuri G. Sidorov

Focal plane arrays based on HgCdTe epitaxial layers MBE-grown on GaAs substrates

Heterostructures HgCdTe/CdTe/GaAs grown by molecular beam epitaxy were used for LWIR FPA fabrication. The technology was developed and 32 by 32 and 128 by 128 photodiode arrays with indium bumps of 15 micrometer height in each pixel were fabricated. Mean NEP is 1.7 by 10-13 W/Hz1/2 and 1.1 by 10-14 W/Hz1/2 for 128 by 128 photodiode arrays with (lambda) c value of 10.4 micrometer and 5.2 micrometer correspondently. The technology of hybrid assembling with continuous control of cold welding on the measuring stand was demonstrated on the example of 32 by 32 LWIR FPA. Mean NEP value of 5.4 by 10-14 W/Hz1/2 with (lambda) c equals 10.6 micrometer at 80 K operation were obtained. using an infrared camera system the infrared image was successfully demonstrated. The NETD value of 0.077 K was obtained under 293 K background condition.

IR photodetectors based on MBE-grown MCT layers

A complete technological cycle has been designed to produce photodetector arrays, which involves MBE growth of Hg1-xCdxTe (MCT) heteroepitaxial layers, fabrication of MCT-based photodetector structures, manufacture of silicon array multiplexers and hybrid assembly of a photodetector module consisting of a photodetector and multiplexer by means of indium micro bumps. Photoelectric parameters are given of photodetector array modules on the basis of photodiodes for the middle (3 - 3.5 μm) and far (8 - 12 μm) infrared ranges, operating at 78 - 80 K and 200 - 220 K temperatures.

MCT heterostructure design and growth by MBE for IR devices

The molecular beam epitaxy (MBE) set-up with analytical control equipment of growth process was designed and fabricated for growing A2B6 compounds including the mercury-containing ones. A technology was elaborated for growing mercury-cadmium-telluride (MCT) solid solution heteroepitaxial structures (HS) by molecular beam epitaxy (MBE) method with a given variation of MCT composition throughout the thickness. HSs MCT MBE on CdZnTe/GaAs substrate with different variation composition in layers at MCT film interfaces were designing and growing. These structures were used for manufacture of high quality single, linear and array photoconductors (PC) and photodiodes (PD) operating at 77 K and 200 - 250 K temperature in the wavelength range of 3 - 5 micrometer and 8 - 12 micrometer, up and over 20 micrometer. Widegap layers at MCT film interfaces are used as passivating coating. Narrowgap layer at MCT film/CdZnTe buffer layers interface is used for decrease of PD series resistance. For decrease of dark currents of photodiodes array operating at 200 K HS MCT MBE were used with special composition distribution of composition throughout the thickness.

Properties of 2x64 linear HgCdTe MBE-grown LWIR arrays with CCD silicon readouts

Mercury-Cadmium-Telluride (MCT) 2 X 64 linear arrays with silicon readouts were designed, manufactured and tested. NCT layers were grown by MBE method on (103) GaAs substrates with CdZnTe buffer layers. 50 X 50 mm n-p-type photodiodes were formed by 80 divided by 120 keV boron implantation. The dark current at 100 mV reversed biased diodes was within 15*30 nA and zero bias resistance-area product was within R0 approximately equals 20 divided by 50 Ohm X cm2. Silicon read-out circuits were designed, manufactured and tested. Read-outs with skimming and partitioning functions were manufactured by n-channel MOS technology with buried or surface channel CCD register. The parameters of LWIR MCT linear arrays with cutoff wavelength (lambda) co 10.0 divided by 12.2 micrometers and Si readouts were tested separately before hybridization. The HgCdTe arrays and Si readouts were hybridized by cold welding In bumps technology. With skimming mode used for integration time of 24-30 ms for such MCT n-p-junctions, the detectivity D*(lambda ) approximately equals 4 X 1010 cmXHz1/2/W. Dark carrier transport mechanisms in these diodes were calculated and compared with experimental data. Two major current mechanisms were included into the current balance equations: trap-assisted tunneling and Shockley-Reed-Hall generation-recombination processes via a defect trap level in the gap. Other current mechanisms (band-to-band tunneling, bulk diffusion) were taken into account as additive contributions. Tunneling rate characteristics were calculated within k-p approximation with the constant barrier electric field. Relatively good agreement with experimental data for diodes with large zero resistance-area products (R0A > 10 OhmXcm2) was obtained.

Radiation effects in photoconductive MCT MBE heterostructures

The first results on a radiation stability investigation of mercury cadmium telluride (MCT) films, grown by molecular beam epitaxy (MBE) are represented. The samples were irradiated by high energy electron beams and gamma rays. Electrophysical and photoelectric parameters of MCT epilayers were measured. Volume material was measured too for the checking with MBE-grown one. MBE epifilms were irradiated on a pulsed electron accelerator with electron energy 1-2 MeV and current density less than 1 μA/cm2 for several fluences. Also MCT epitaxial heterostructures were irradiated by Co60 gamma rays. The same experiments were carried out for volume material. The analysis of dependence of Hall coefficient and conductivity from temperature and magnetic field (B) for p- and n- type samples was made. The irradiation of epilayers and volume MCT in the investigated range of irradiation fluences does not give both creation of electrical active damages in high concentrations and reconstruction of initial defects. Thus, MBE films of MCT have the high radiation stability to an electron and gamma irradiation. The obtained first results allow us to speak about high performance of explored MCT epilayers.

V-defects at MBE MCT heteroepitaxy on GaAs(310) and Si(310) substrates

CdTe and HgCdTe layers were grown by MBE on GaAs(310) and Si(310) substrates. The dependences of microrelief height and macroscopic defects densities on the growth conditions of CdTe layer are plotted. CdTe buffer layers with the average height of surface relief of 2 nm are obtained. HgCdTe layers on GaAs(310) substrates with V-shaped defects density of 200-300 cm-2 were grown. When Si(310) substrates are used, the boundaries between antiphase domains are an additional reason for formation of V-shaped defects. It is shown, that the optimization of surface preparation processes and the growth conditions allows to grow one-domain films of CdTe buffer layers on Si(310) substrates and to lower the density of V-shaped defects.

MCT linear arrays and associated silicon readouts

MCT 2×64 and 4×288 linear arrays with silicon readouts were designed, manufactured and tested. (013) MCT MBE layers were grown on GaAs substrates with ZnTe and CdTe buffer layers. 2×64 arrays were also manufactured on the base of LPE layers on CdZnTe (111) substrates. 50×55 and ≈30×30 μm area n-p-type photodiodes were formed by 50 ÷ 120 keV boron implantation. The dark currents at V ≈ 100 mV reversed biased diodes used in arrays with cutoff wavelength λco ≈ 10.0 - 12.2 μm were within 15 - 50 nA and zero bias resistance-area products were within R0A ≈ 5 ÷ 20 Ohm×cm2. Designed silicon readouts with skimming and partitioning functions were manufactured by n-channel MOS technology with buried or surface channel CCD register. For achievement with the silicon readouts the deselection function, the “composite” technology approach was considered. In this case both the technology of n-channel CCD and CMOS technology were applied, which allow to weaken considerably the technological design rules for realization of 288×4 readouts with deselection of “dead” elements. It is shown that 2.5 μm design rules for CCD and 2.0 design rules for CMOS technologies allow to realize most of the functions needed for 288×4 MCT array operation with deselection function. Before hybridisation the parameters of MCT linear arrays and Si readouts were tested separately. HgCdTe arrays and Si readouts were hybridised by cold welding In bumps technology. In dependence of FOV with skimming mode used for integration time of 8 - 20 μs detectivities within D*λ (0.4 - 1.7)×1011 cm×Hz1/2/W were achieved in dependence of the array format. Dark carrier transport mechanisms in MCT diodes were calculated and compared with experimental data.

LWIR detectors for subthermonuclear plasma study

We developed high-frequency (HF) photodiodes (PD) and photoconductors (PC) operated in spectral range 1-20 mum and frequencies over 1 GHz on the basis of HgCdTe heteroepitaxial structures (HS) with special composition distribution throughout the thickness grown on ZnCdTe/GaAs substrates by molecular beam epitaxy (MBE). The measurement HF PD and PC parameters were carried out. HF PD were used for study of subthermonuclear plasma.

2X64 linear LWIR arrays based in HgCdTe MBE-grown layers and CCD silicon readouts

Two X sixty-four linear photodiode arrays on the base of HgCdTe MBE grown layers with CCD silicon readouts were designed, fabricated and tested. It is shown that detectivity for the given arrays even with skimming mode used for long integration times that is need for large square n-p-junctions used and cut-off wavelength of 12.2 micrometer was near the ultimate performance limit.