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Publication
Featured researches published by Yutaka Hirasawa.
Journal of Japan Institute of Electronics Packaging | 2000
Takuya Yamamoto; Osamu Nakano; Yutaka Hirasawa; Takashi Kataoka
Most of the printed circuit boards are produced by subtractive method. In order to achieve fine lines & spaces (under L/S=50/50μm) by subtractive method, it is essential to reduce thickness of copper. This paper describes an experimentally obtained relation between allowable thickness of copper and pattern pitch on subtractive processing. Empirical formula were introduced to simulate the progress of etching. Simulated result showed good conformance with actual etched pattern. To form fine lines & spaces of under L/S=50/50μm, copper foil of thinner than 5μm is needed.
Archive | 1998
Takashi Kataoka; Yutaka Hirasawa; Takuya Yamamoto
Archive | 1999
Makoto Dobashi; Tsutomu Higuchi; Yutaka Hirasawa; Taku Kataoka; Shinichi Obata; Akiko Sugioka; Sakiko Tomonaga; Takuya Yamamoto; Atsushi Yoshioka; 淳志 吉岡; 誠 土橋; 真一 小畠; 拓也 山本; 健一郎 岩切; 裕 平沢; 咲子 朝長; 晶子 杉岡; 勉 樋口; 卓 片岡
Archive | 2000
Naotomi Takahashi; Yutaka Hirasawa
Archive | 1999
Yutaka Hirasawa; Takashi Kataoka; Akigo Sugioka; Takuya Yamamoto; Junshi Yoshioka
Archive | 2000
Yutaka Hirasawa; Taku Kataoka; Naotomi Takahashi; Takuya Yamamoto; 拓也 山本; 裕 平沢; 卓 片岡; 直臣 高橋
Archive | 1999
Makoto Dobashi; Tsutomu Higuchi; Yutaka Hirasawa; Taku Kataoka; Shinichi Obata; Akiko Sugimoto; Sakiko Tomonaga; Takuya Yamamoto; Atsushi Yoshioka; 淳志 吉岡; 誠 土橋; 真一 小畠; 拓也 山本; 健一郎 岩切; 裕 平沢; 咲子 朝長; 晶子 杉元; 勉 樋口; 卓 片岡
Archive | 1999
Tsutomu Higuchi; Yutaka Hirasawa; Takashi Kataoka; Takuya Yamamoto
Archive | 1999
Yutaka Hirasawa; Taku Kataoka; Akiko Sugioka; Takuya Yamamoto; Atsushi Yoshioka
Archive | 2000
Junshi Yoshioka; Akiko Sugimoto; Makoto Dobashi; Yutaka Hirasawa
