Yutaka Moroishi

Synthesis and PSA performance study for novel acrylic and butyl acrylate block copolymers

Abstract Novel acrylic acid (AA) and butyl acrylate (BA) type block polymers were synthesized by living radical polymerization and evaluated their pressure sensitive adhesive performances. AA/BA/AA type triblock copolymers have good adhesive performances and holding power even without cross-linking. According to TEM pictures, micro-domain structures were observed for these triblock copolymers. These micro-domain structures may contribute to the high holding power for adhesive samples, since it was thought that the AA block micro-domains generated the hydrogen bonding power.

New process for resist removal after lithography process using adhesive tape

A novel concept for the resist removal after the photolithography in the wafer process is introduced. This new process is to peel off the resist layer with a special adhesive tape. A very little contamination on wafers is confirmed. Especially the metal contamination with this new process is very little compared with conventional O2 plasma ashing. Therefore the electrical properties of oxide layer and substrate are significantly improved. This new process should be very effective for the production of front-edge devices because of this improvement. In this paper, along with these observations, the mechanism of the removal is discussed. The monomer in the adhesive layer migrates into the resist layer and the two layers consolidated together. Very fine microanalysis technique to detect this phenomenon in situ is also explained.