Zenji Yatabe

Characterization of interface states in Al2O3/AlGaN/GaN structures for improved performance of high-electron-mobility transistors

We have investigated the relationship between improved electrical properties of Al2O3/AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) and electronic state densities at the Al2O3/AlGaN interface evaluated from the same structures as the MOS-HEMTs. To evaluate Al2O3/AlGaN interface state densities of the MOS-HEMTs, two types of capacitance-voltage (C-V) measurement techniques were employed: the photo-assisted C-V measurement for the near-midgap states and the frequency dependent C-V characteristics for the states near the conduction-band edge. To reduce the interface states, an N2O-radical treatment was applied to the AlGaN surface just prior to the deposition of the Al2O3 insulator. As compared to the sample without the treatment, the N2O-radical treated Al2O3/AlGaN/GaN structure showed smaller frequency dispersion of the C-V curves in the positive gate bias range. The state densities at the Al2O3/AlGaN interface were estimated to be 1 × 1012 cm−2 eV−1 or less around the ...

Characterization of electronic states at insulator/(Al)GaN interfaces for improved insulated gate and surface passivation structures of GaN-based transistors

This paper presents a systematic characterization of electronic states at insulators/(Al)GaN interfaces, particularly focusing on insulator/AlGaN/GaN structures. First, we review important results reported for GaN metal–insulator–semiconductor (MIS) structures. SiO2 is an attractive material for MIS transistor applications due to its large bandgap and high chemical stability. In-situ SiNx is effective for improving the operation stability of high electron mobility transistors (HEMTs). Meanwhile, Al2O3/GaN structures have high band offsets and low interface state densities, which are also desirable for insulated gate applications. We have proposed a calculation method for describing capacitance–voltage (C–V) characteristics of HEMT MIS structures for evaluating electronic state properties at the insulator/AlGaN interfaces. To evaluate near-midgap states at insulator/AlGaN interfaces, a photo-assisted C–V technique using photon energies less than the bandgap of GaN has been developed. Using the calculation in conjunction with the photo-assisted C–V technique, we estimate interface state density distributions at the Al2O3/AlGaN interfaces.

Insulated gate and surface passivation structures for GaN-based power transistors

Recent years have witnessed GaN-based devices delivering their promise of unprecedented power and frequency levels and demonstrating their capability as an able replacement for Si-based devices. High-electron-mobility transistors (HEMTs), a key representative architecture of GaN-based devices, are well-suited for high-power and high frequency device applications, owing to highly desirable III-nitride physical properties. However, these devices are still hounded by issues not previously encountered in their more established Siand GaAs-based devices counterparts. Metal–insulator–semiconductor (MIS) structures are usually employed with varying degrees of success in sidestepping the major problematic issues such as excessive leakage current and current instability. While different insulator materials have been applied to GaN-based transistors, the properties of insulator/III-N interfaces are still not fully understood. This is mainly due to the difficulty of characterizing insulator/AlGaN interfaces in a MIS HEMT because of the two resulting interfaces: insulator/AlGaN and AlGaN/GaN, making the potential modulation rather complicated. Although there have been many reports of low interface-trap densities in HEMT MIS capacitors, several papers have incorrectly evaluated their capacitance–voltage (C–V) characteristics. A HEMT MIS structure typically shows a 2-step C–V behavior. However, several groups reported C–V curves without the characteristic step at the forward bias regime, which is likely to the high-density states at the insulator/ AlGaN interface impeding the potential control of the AlGaN surface by the gate bias. In this review paper, first we describe critical issues and problems including leakage current, current collapse and threshold voltage instability in AlGaN/GaN HEMTs. Then we present interface properties, focusing on interface states, of GaN MIS systems using oxides, nitrides and high-κ dielectrics. Next, the properties of a variety of AlGaN/GaN MIS structures as well as different characterization methods, including our own photo-assisted C–V technique, essential for understanding and developing successful surface passivation and interface control schemes, are given in the subsequent section. Finally we highlight the important progress in GaN MIS interfaces that have recently pushed the frontier of nitride-based device technology.

Highly-stable and low-state-density Al2O3/GaN interfaces using epitaxial n-GaN layers grown on free-standing GaN substrates

Interface characterization was carried out on Al2O3/GaN structures using epitaxial n-GaN layers grown on free-standing GaN substrates with relatively low dislocation density (<3 × 106 cm−2). The Al2O3 layer was prepared by atomic layer deposition. The as-deposited metal-oxide-semiconductor (MOS) sample showed a significant frequency dispersion and a bump-like feature in capacitance-voltage (C–V) curves at reverse bias, showing high-density interface states in the range of 1012 cm−1 eV−1. On the other hand, excellent C–V characteristics with negligible frequency dispersion were observed from the MOS sample after annealing under a reverse bias at 300 °C in air for 3 h. The reverse-bias-annealed sample showed state densities less than 1 × 1011 cm−1 eV−1 and small shifts of flat-band voltage. In addition, the C–V curve measured at 200 °C remained essentially similar compared with the room-temperature C–V curves. These results indicate that the present process realizes a stable Al2O3/GaN interface with low int...

Reduced thermal resistance in AlGaN/GaN multi-mesa-channel high electron mobility transistors

Dramatic reduction of thermal resistance was achieved in AlGaN/GaN Multi-Mesa-Channel (MMC) high electron mobility transistors (HEMTs) on sapphire substrates. Compared with the conventional planar device, the MMC HEMT exhibits much less negative slope of the ID-VDS curves at high VDS regime, indicating less self-heating. Using a method proposed by Menozzi and co-workers, we obtained a thermal resistance of 4.8 K-mm/W at ambient temperature of ∼350 K and power dissipation of ∼9 W/mm. This value compares well to 4.1 K-mm/W, which is the thermal resistance of AlGaN/GaN HEMTs on expensive single crystal diamond substrates and the lowest reported value in literature.

Effects of Cl2-Based Inductively Coupled Plasma Etching of AlGaN on Interface Properties of Al2O3/AlGaN/GaN Heterostructures

The effects of the inductively coupled plasma (ICP) etching of AlGaN on the interface properties of the Al2O3/AlGaN/GaN structures prepared by atomic layer deposition were investigated. It was found from the photoassisted capacitance–voltage (C–V) results that the ICP etching of the AlGaN surface significantly increased the interface state density up to 8×1012 cm-2 eV-1 at the Al2O3/AlGaN interface. The transmission electron microscopy and X-ray photoelectron spectroscopy analyses indicated that the monolayer-level roughness, disorder of the chemical bonds at the AlGaN surface caused poor C–V characteristics due to high-density interface states at the Al2O3/ICP-etched AGaN interface.

Current Collapse Reduction in AlGaN/GaN HEMTs by High-Pressure Water Vapor Annealing

We have demonstrated for the first time a remarkable reduction of current collapse in AlGaN/GaN high-electron-mobility transistors (HEMTs) by high-pressure water vapor annealing (HPWVA). The device subjected to HPWVA exhibited considerably low dynamic ON-resistance (RON), suggesting highly improved performance of these devices. Analyses of the results on normalized dynamic RON experiments have shown the elimination of deeper traps by HPWVA, leading to the substantially reduced current collapse. X-ray photoelectron spectroscopy (XPS) studies revealed a significant increase in the oxygen core-level O 1s peak. Moreover, angle-resolved XPS suggested the formation of surface oxide layer. These results indicate that the effective reduction of current collapse in the HPWVA-processed samples is likely due to the incorporation of active oxygen species generated by the HPWV into the AlGaN surface. These oxygen atoms eventually fill up near-surface nitrogen vacancies and promote the formation of Ga2O3 native oxide and possibly Ga2O suboxide, which is known to be an excellent III-V surface passivant. HPWVA is a relatively simple, low-damage, and low-temperature process, and hence, it is found to be a highly feasible and promising alternative for realizing AlGaN/GaN HEMTs with improved performance.

Characterization of Low-Frequency Noise in Etched GaAs Nanowire Field-Effect Transistors Having SiNx Gate Insulator

Low-frequency noise in SiNx insulator–gate GaAs-based etched nanowire field-effect transistors (FETs) is investigated, focusing on the device size dependence and the effect of electron traps in the insulator. Intensity of the drain current noise is found to systematically increase when the nanowire width and gate length decrease, as indicated by the conventional FET noise model. Noise spectrum also changes continuously from 1/f to 1/f2 with the decrease of the device size, which is not observed in Schottky-gate nanowire FETs. Theoretical analysis shows that traps having short time constants mainly affect on the spectrum slope, whereas those having long time constants only shift the spectrum and do not affect on the slope. Observed size dependence of the spectrum slope is explained by broadening of the distribution of the time constant rather than the change in the combination of discrete traps having different time constants.

Large photocurrents in GaN porous structures with a redshift of the photoabsorption edge

Photoresponse and photoabsorption properties of GaN porous structures were investigated by measuring photocurrent and spectroscopic photoabsorption under monochromatic light with various wavelengths. The measured photocurrents on the porous GaN electrodes were larger than those on the planar electrodes due to the unique features of the former electrode, such as large surface area and low photoreflectance properties. Moreover, the photocurrents were observed even under illumination with wavelength of 380 nm, corresponding to photon energy of 3.26 eV, which is 130 meV lower than the bandgap energy of bulk GaN. A potential simulation revealed that a high-electric field was induced at the pore tips due to modification of the potential in the porous structures. The observed redshift of the photoabsorption edge can be qualitatively explained by the Franz–Keldysh effect.

Characterization of capture cross sections of interface states in dielectric/III-nitride heterojunction structures

We performed, for the first time, quantitative characterization of electron capture cross sections σ of the interface states at dielectric/III-N heterojunction interfaces. We developed a new method, which is based on the photo-assisted capacitance-voltage measurements using photon energies below the semiconductor band gap. The analysis was carried out for AlGaN/GaN metal-insulator-semiconductor heterojunction (MISH) structures with Al2O3, SiO2, or SiN films as insulator deposited on the AlGaN layers with Al content (x) varying over a wide range of values. Additionally, we also investigated an Al2O3/InAlN/GaN MISH structure. Prior to insulator deposition, the AlGaN and InAlN surfaces were subjected to different treatments. We found that σ for all these structures lies in the range between 5×10−19 and 10−16 cm2. Furthermore, we revealed that σ for dielectric/AlxGa1−xN interfaces increases with increasing x. We showed that both the multiphonon-emission and cascade processes can explain the obtained results.