Zhang Yupeng

Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic

Abstract A series of Al-Ni reactive multilayer with different modulation periods were fabricated by DC magnetron sputtering process, and transient-liquid-phase (TLP) bonding of copper and Al 2 O 3 ceramic was carried out by the multilayer foils. The microstructure of the as-deposited foils and the cermet joint were investigated. The reaction behaviors of Al/Ni multilayers were characterized by means of DSC and X-ray diffraction. The results show that the application of Al/Ni multilayer foils not only decreases the joining temperature of the copper and Al 2 O 3 ceramic, but also improves the quality of the joint.

Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers

Abstract A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity