Zhao Zhenqing

Package module having exposed heat sink

STACK STRUCTURE AND THE MANUFACTURING METHOD OF THE SAME

Packaged module, packaged module stacked structure and manufacturing method thereof

Package type power circuit module

Vertically-connected power module and pin for stack connection thereof

Package module and package method thereof

Plastic package power module

Vertically connected power module and stacked and connected pins thereof

Packaged power circuit module

Magnetic core assembly and gap control method thereof