Zhenhua Shao

Multiform pluggable Tx/Rx module for OC-3/OC-12

Multi Form Pluggable (MFP) 8-channel optical link modules for OC-3 (STM-1) and OC-12 (STM-4) intermediate reach (IR-a) applications have been developed. The MFP module can increase packaging density by 60% and reduce power consumption by 60% for virtually the same cost compared to the use of conventional single-channel 8 Small Form Pluggable (SFP) modules.

Planar assembled flexible interconnect link with hybrid optical/electrical data transmission for mobile device applications

New serial data transmission standards for cameras and displays in mobile devices are demanding low power multi-gigabit high speed serial links which must operate in noisy RF environments. [1] To meet these requirements a hybrid optical/electrical interconnect link is proposed. By combining a traditional flexible electrical interconnect with an advanced low power optical interconnect it is possible to meet the demands of this future market. The two key developments discussed in this paper are: the electrical/optical switching system, which is the basis for the hybrid link, and the all planar assembly process, featuring an edge emitting laser diode, edge receiving photodiode and a flexible polymer waveguide.

High Density Packaged 4-Channel Transceiver for Metro and Access Applications

A high, density packaged 4-channel optical transceiver using a 1310 nm FP-LD array and a PD array has been newly developed for OC-3, OC-12, Gig-E and fiber channel intermediate reach applications. The output optical power of each of the four LDs is independently controlled by automatic power control (APC). Both module package size and power consumption can be reduced by less than half when compared to the use of four conventional single-channel small form factor pluggable (SFP) modules