Zhifu Yin

Fabrication of two dimensional polyethylene terephthalate nanofluidic chip using hot embossing and thermal bonding technique

We present in this paper a method for obtaining a low cost and high replication precision 2D (two dimensional) nanofluidic chip with a PET (polyethylene terephthalate) sheet, which uses hot embossing and a thermal bonding technique. The hot embossing process parameters were optimized by both experiments and the finite element method to improve the replication precision of the 2D nanochannels. With the optimized process parameters, 174.67 ± 4.51 nm wide and 179.00 ± 4.00 nm deep nanochannels were successfully replicated into the PET sheet with high replication precision of 98.4%. O2 plasma treatment was carried out before the bonding process to decrease the dimension loss and improve the bonding strength of the 2D nanofluidic chip. The bonding parameters were optimized by bonding rate of the nanofluidic chip. The experiment results show that the bonding strength of the 2D PET nanofluidic chip is 0.664 MPa, and the total dimension loss of 2D nanochannels is 4.34 ± 7.03 nm and 18.33 ± 9.52 nm, in width and depth, respectively. The fluorescence images demonstrate that there is no blocking or leakage over the entire micro- and nanochannels. With this fabrication technology, low cost polymer nanochannels can be fabricated, which allows for commercial manufacturing of nano-components.

A novel 2D silicon nano-mold fabrication technique for linear nanochannels over a 4 inch diameter substrate

A novel low-cost 2D silicon nano-mold fabrication technique was developed based on Cu inclined-deposition and Ar+ (argon ion) etching. With this technique, sub-100 nm 2D (two dimensional) nano-channels can be etched economically over the whole area of a 4 inch n-type <100> silicon wafer. The fabricating process consists of only 4 steps, UV (Ultraviolet) lithography, inclined Cu deposition, Ar+ sputter etching, and photoresist & Cu removing. During this nano-mold fabrication process, we investigated the influence of the deposition angle on the width of the nano-channels and the effect of Ar+ etching time on their depth. Post-etching measurements showed the accuracy of the nanochannels over the whole area: the variation in width is 10%, in depth it is 11%. However, post-etching measurements also showed the accuracy of the nanochannels between chips: the variation in width is 2%, in depth it is 5%. With this newly developed technology, low-cost and large scale 2D nano-molds can be fabricated, which allows commercial manufacturing of nano-components over large areas.

Low auto-fluorescence fabrication methods for plastic nanoslits.

Plastic nanofluidic devices are becoming increasingly important for biological and chemical applications. However, they suffer from high auto-fluorescence when used for on-chip optical detection. In this study, the auto-fluorescence problem of plastic nanofluidic devices was remedied by newly developed fabrication methods that minimise their auto-fluorescence: one by depositing a gold (Au) layer on them, the other by making them ultra-thin. In the first method, the Au layer [minimum thickness is 40 nm on 150 μm SU-8, 50 nm on 1 mm polyethylene terephthalate (PET), and 40 on 2 nm polymethyl methacrylate (PMMA)] blocks the auto-fluorescence of the polymer; in the second method, auto-fluorescence is minimised by making the chips ultra-thin, selected operating thickness of SU-8 is 20 μm, for PET it is 150 μm, and for PMMA it is 0.8 mm.

A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength

Plastic planar nanofluidic chips are becoming increasingly important for biological and chemical applications. However, the majority of the present bonding methods for planar nanofluidic chips suffer from high dimension loss and low bonding strength. In this work, a novel thermal bonding technique based on O2 plasma and ethanol treatment was proposed. With the assistance of O2 plasma and ethanol, the PET (polyethylene terephthalate) planar nanofluidic chip can be bonded at a low bonding temperature of 50 °C. To increase the bonding rate and bonding strength, the O2 plasma parameters and thermal bonding parameters were optimized during the bonding process. The tensile test indicates that the bonding strength of the PET planar nanofluidic chip can reach 0.954 MPa, while the auto-fluorescence test demonstrates that there is no leakage or blockage in any of the bonded micro- or nanochannels.