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Dive into the research topics where Zhixiong Huang is active.

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Featured researches published by Zhixiong Huang.


Journal of Materials Science & Technology | 2010

Microstructure and Ferroelectric Properties of (Bi0.9Ho0.1)3.999Ti2.997V0.003O12 Thin Films Prepared by Sol-gel Method for Nonvolatile Memory

Chengju Fu; Zhixiong Huang; Jie Li; Dongyun Guo

The (Bi 0.9 Ho 0.1 ) 3.999 Ti 2.997 V 0.003 O 12 (BHTV) films have been prepared on Pt/Ti/SiO 2 /Si substrates by solgel method. The microstructure and ferroelectric properties of the BHTV films were investigated. The BHTV films show a single phase of Bi-layered Aurivillius structure and dense microstructure. The Ho 3+ /V 5+ co-substitution can effectively improve the ferroelectric properties. The BHTV film exhibits good ferroelectric properties with 2 P r of 47.6°C/cm 2 , 2 E c of 265 kV/cm (at applied field of 420 kV/cm), dielectric constant of 305, dielectric loss of 0.031 (at 1 MHz), good insulting behavior, as well as the fatigue-free behavior.


Materials Research Innovations | 2015

Preparation and thermal stability of boron-containing phenolic resin/microcrystalline muscovite composites

Jie Ding; Zhixiong Huang; Haitao Luo; Yan Qin; Minxian Shi

Abstract In order to further improve thermal stability of the boron-modified phenolic resin, we combined boron-modified phenolic resin and microcrystalline muscovite over a range of microcrystalline muscovite loadings (5–20 wt-%) to prepare composites. Microcrystalline muscovite was modified by titanate coupling agent. Fourier transmission-infrared analysis showed that the titanate coupling agent chemically bonded with the microcrystalline muscovite powder. The modified microcrystalline muscovite was mixed with boron-modified phenolic resin matrix in the molten state, and the composites were cured by compression moulding. Thermogravimetric analysis showed the effect of microcrystalline muscovite content to enhance decomposition temperatures and residual weight at 1000°C of the composites. Flexural test showed that the flexural strength before heat-treated was reduced with incremental loadings of microcrystalline muscovite fillers. On the contrary, after heat-treated at 1000°C, the flexural strength is increased. Scanning electron microscopy illustrated the microstructure evolution of the composites at elevated temperatures.


Materials Research Innovations | 2015

The role of microcrystalline muscovite to enhance thermal stability of boron-modified phenolic resin, structural and elemental studies in boron-modified phenolic resin/ microcrystalline muscovite composite

Jie Ding; Zhixiong Huang; Haitao Luo; Yan Qin; Minxian Shi

Abstract A polymer matrix composite was prepared by incorporating microcrystalline muscovite fillers into a boron-modified phenolic resin. Thermogravimetric analyses indicated that microcrystalline muscovite significantly enhanced the thermal stability of boron-modified phenolic resin under air atmosphere. Then the composite was heated in a furnace. After heated, the homogeneous structure of the composite was converted into a layered structure with a ceramic shell on the surface. The layered structure was investigated by electron probe micro-analysis and energy dispersive spectroscopy. The elemental content and chemical binding state of the layered structure were investigated by X-ray photoelectron spectroscopy. On the surface, the reaction between SiO2 and Al2O3 occurred, thus microcrystalline muscovite fillers were transformed into mullite shell. The mullite shell could protect char from further oxidation at elevated temperatures. Therefore, a amount of reserved char could react with SiO2 to generate Si–C bond in the inner of the composite.


Materials Research Innovations | 2015

Micro-structural and elementary evolution of a muscovite/boron phenol-formaldehyde composite at high temperatures

Yan Qin; H. Z. Ma; Y. Pei; Jie Ding; Zhixiong Huang

Abstract A muscovite/boron phenol-formaldehyde composite is prepared by compression moulding. After 10 min pyrolysis at 1000°C, it was still stable with a thermal residue value of 77.8%. The surface of the thermal residue was covered by shell-like coatings that may protect interior materials from further oxidation and decomposition, according to the scanning electron microscope and energy dispersive X-ray investigations. Also, a thermogravimetry analysis study showed that the muscovite/boron phenol-formaldehyde composite has much higher heat-resistance than pure boron phenol-formaldehyde. In addition, X-ray photoelectron spectroscopy characterisation suggested that the percentage of carbon in the thermal residue exceeded in the muscovite/boron phenol-formaldehyde composite. This suggested that most of the carbon was reserved and the carbon framework was well protected. Further analysis revealed that nearly half of the boric oxide, alumina and silica in muscovite/boron phenol-formaldehyde composite were reduced to boron nitride, aluminium and silicon carbide, respectively, after the pyrolysis.


Journal of Electronic Materials | 2010

Preparation and Ferroelectric Properties of Ho3+/Mo6+ Cosubstituted Bi4Ti3O12 Thin Films by Sol–Gel Method

Chengju Fu; Zhixiong Huang; Jie Li; Dongyun Guo


Archive | 2007

Preparation method of piezoelectric ceramic/epoxy resin composite

Zhixiong Huang; Minxian Shi; Huimin He; Yan Qin; Yanbing Wang; Guorui Yang; Yaming Li; Tao Wei


Journal of Wuhan University of Technology-materials Science Edition | 2009

Performance of CTBN(carboxyl-terminated poly (butadiene-co-acrylonitrile))-EP(diglycidyl ether of bisphenol-A (DGEBA)) prepolymers and CTBN-EP/polyetheramine (PEA) system

Minxian Shi; Zhixiong Huang; Yaming Li; Guorui Yang


Science China-technological Sciences | 2009

Effect of Bi content in precursor solutions on microstructure and ferroelectric properties of bismuth cerium titanate thin films

Chengju Fu; Zhixiong Huang; Jie Li; Dong-Yun Guo


Science China-technological Sciences | 2008

Ferroelectric properties of Bi 3.4 Ho 0.6 Ti 3 O 12 thin films prepared by sol-gel method

Chengju Fu; Zhixiong Huang; Jie Li; Dong-Yun Guo


Journal of Wuhan University of Technology-materials Science Edition | 2008

Effect of thermal crosslink conditions on dynamic mechanical behaviors of flexible epoxy

Ping Dai; Yanbing Wang; Zhixiong Huang

Collaboration


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Chengju Fu

Wuhan University of Technology

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Jie Li

Chongqing University of Science and Technology

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Minxian Shi

Wuhan University of Technology

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Jie Ding

Wuhan University of Technology

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Yan Qin

Wuhan University of Technology

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Dongyun Guo

Wuhan University of Technology

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Guorui Yang

Wuhan University of Technology

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Haitao Luo

Wuhan University of Technology

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Yaming Li

Wuhan University of Technology

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