A. Dimoulas

Fermi-level pinning and charge neutrality level in germanium

The Schottky barrier height in metal/Ge contacts shows weak dependence on the metal work function indicating strong Fermi-level pinning close to the Bardeen limit. The pinning factor S is about 0.05 and the charge neutrality level (CNL) is only about 0.09eV above the top of the valence band. Because of this, the Fermi level in Ge lies higher than CNL in most cases of interest so that unpassivated acceptorlike gap states at the interface are easily filled, building up a net negative fixed charge. This could prevent efficient inversion of a p-type Ge surface in a metal-oxide-semiconductor structure.

HfO2 high-κ gate dielectrics on Ge (100) by atomic oxygen beam deposition

Thin insulator films of the high-κ dielectric HfO2 are deposited on Ge(100) substrates by evaporating Hf in atomic oxygen beams after in situ thermal desorption of the native oxide in ultrahigh vacuum and subsequent treatment of the clean Ge surface in oxygen and nitrogen. It is shown that HfO2 forms atomically sharp interfaces with Ge and behaves as an excellent insulator with dielectric permittivity κ∼25, which is close to the expected bulk value. Very low equivalent oxide thickness of 0.75 (±0.1) nm with a low gate leakage current of ∼4.5×10−4A∕cm2 at 1 V in accumulation is achieved. Strong frequency dispersion of the inversion capacitance and low frequency behavior of the high frequency capacitance–voltage curves is observed. This is attributed to a combined effect of a high generation rate of minority carriers due to impurity traps and the high intrinsic carrier concentration in Ge, which result in a short minority carrier response time.

Evidence for graphite-like hexagonal AlN nanosheets epitaxially grown on single crystal Ag(111)

Ultrathin (sub-monolayer to 12 monolayers) AlN nanosheets are grown epitaxially by plasma assisted molecular beam epitaxy on Ag(111) single crystals. Electron diffraction and scanning tunneling microscopy provide evidence that AlN on Ag adopts a graphite-like hexagonal structure with a larger lattice constant compared to bulk-like wurtzite AlN. This claim is further supported by ultraviolet photoelectron spectroscopy indicating a reduced energy bandgap as expected for hexagonal AlN.

Electrical properties of La2O3 and HfO2/La2O3 gate dielectrics for germanium metal-oxide-semiconductor devices

Germanium metal-insulator-semiconductor capacitors with La2O3 dielectrics deposited at high temperature or subjected to post deposition annealing show good electrical characteristics, especially low density of interface states D-it in the 10(11) eV(-1) cm(-2) range, which is an indication of good passivating proper-ties. However, the K value is estimated to be only about 9, while there is no,evidence for an interfacial layer. This is explained in terms of a spontaneous and strong reaction between La2O3 and Ge substrate to form a low K and leaky La-Ge-O germanate over the entire film thickness, which, however, raises concerns about gate scalability. Combining a thin (similar to 1 nm) La2O3 layer with thickef HfO2 degrades the electrical characteristics, including Dit, but improves gate leakage and equivalent oxide thickness, indicating a better potential for scaling. Identifying suitable gate dielectric stack which combines good passivating/interfacial properties with good scalability remains a challenge. (c) 2008 American Institute of Physics.

Subnanometer-equivalent-oxide-thickness germanium p-metal-oxide-semiconductor field effect transistors fabricated using molecular-beam-deposited high-k/metal gate stack

Metal-oxide-semiconductor field effect transistors (MOSFET) with a thin high-k dielectric were fabricated on bulk n-type germanium substrates. Surface oxides were thermally desorbed in situ by heating the substrates under ultrahigh vacuum conditions. First an ultrathin passivating layer was formed by evaporating germanium in the presence of atomic oxygen and nitrogen supplied from a remote radio frequency plasma source. Subsequently, the HfO2 dielectric was deposited by evaporating hafnium in the presence of atomic oxygen. An in situ TaN metal gate was similarly deposited. Long channel devices were fabricated using a standard process flow. These devices exhibited a low equivalent oxide thickness (EOT) of 0.7nm with gate leakage less than 15mA∕cm2 at VFB+1V. Device mobility was extracted from Is-Vg and split C-V characteristics. Results indicate a 2× mobility enhancement in Ge p-MOSFET devices compared to Si control devices. The demonstration of subnanometer EOT suggests that high-k gate dielectrics on ger...

Evidence for hybrid surface metallic band in (4 × 4) silicene on Ag(111)

The electronic band structure of monolayer (4 × 4) silicene on Ag(111) is imaged by angle resolved photoelectron spectroscopy. A dominant hybrid surface metallic band is observed to be located near the bulk Ag sp-band which is also faintly visible. The two-dimensional character of the hybrid band has been distinguished against the bulk character of the Ag(111) sp-band by means of photon energy dependence experiments. The surface band exhibits a steep linear dispersion around the K¯Ag point and has a saddle point near the M¯Ag point of Ag(111) resembling the π-band dispersion in graphene.

Silicene: a review of recent experimental and theoretical investigations

Silicene is the silicon counterpart of graphene, i.e. it consists in a single layer of Si atoms with a hexagonal arrangement. We present a review of recent theoretical and experimental works on this novel two dimensional material. We discuss first the structural, electronic and vibrational properties of free-standing silicene, as predicted from first-principles calculations. We next review theoretical studies on the interaction of silicene with different substrates. The growth and experimental characterization of silicene on Ag(1 1 1) is next discussed, providing insights into the different phases or atomic arrangements of silicene observed on this metallic surface, as well as on its electronic structure. Recent experimental findings about the likely formation of hexagonal Si nanosheets on MoS2 are also highlighted.

Very high-κ ZrO2 with La2O3 (LaGeOx) passivating interfacial layers on germanium substrates

Thin La2O3 (LaGeOx) passivating layers combined with ZrO2 caps form a chemically stable bilayer gate stack on Ge with good electrical properties. The most important observation is that a higher-κ tetragonal zirconia phase coexists with the most commonly observed monoclinic, increasing the κ value of the oxide to about 32, thus benefiting the measured stack equivalent oxide thickness. This indicates that the ZrO2/La2O3 combination could be a promising candidate gate stack for Ge metal-oxide-semiconductor devices in terms of scalability.

Intrinsic carrier effects in HfO2–Ge metal–insulator–semiconductor capacitors

Germanium metal–insulator–semiconductor capacitors with HfO2 or other high-κ gate dielectrics show unusual low frequency behavior of the high frequency (1 kHz or higher) capacitance-voltage characteristics when biased in inversion. Here, we provide evidence that this effect is partly due to the high intrinsic carrier concentration ni in Ge. We show in particular that the ac conductance in inversion is thermally activated and it is governed either by generation-recombination processes in depletion, varying proportional to ni or by diffusion-limited processes varying as ni2, depending on whether the temperature is below or above 45 °C, respectively. From these measurements, we also show that the minority carrier response time in Ge is very short, in the microsecond range (much shorter than in Si), depending inversely proportional to ni at room temperature. This means that due to high ni, the inversion charge is built fast in response to high frequency signals at the gate, inducing the observed low frequency...

Germanium-induced stabilization of a very high-k zirconia phase in ZrO2/GeO2 gate stacks

Electrical data on ZrO2/GeO2 stacks prepared by atomic oxygen beam deposition on Ge at 225 °C reveal a relatively weak dependence of the stack equivalent oxide thickness upon the ZrO2 thickness. This trend points to a very high zirconia dielectric permittivity (k) value which is estimated to be around 44. This is indicative of zirconia crystallization into a tetragonal phase which is also supported by x-ray diffraction data. X-ray photoelectron spectroscopy analysis is in line with the assumption that due to a finite GeO2 decomposition, Ge is incorporated into the growing ZrO2, thus, stabilizing the high-k tetragonal phase.