A. Uranga

Monolithic CMOS MEMS Oscillator Circuit for Sensing in the Attogram Range

This letter presents the design, fabrication, and demonstration of a CMOS/microelectromechanical system (MEMS) electrostatically self-excited resonator based on a submicrometer-scale cantilever with ~1 ag/Hz mass sensitivity. The mechanical resonator is the frequency-determining element of an oscillator circuit monolithically integrated and implemented in a commercial 0.35 mum CMOS process. The oscillator is based on a Pierce topology adapted for the MEMS resonator that presents a mechanical resonance frequency of ~6 MHz, a relative low quality factor of 100, and a large motional resistance of ~25 M. The MEMS oscillator has a frequency stability of ~1.6 Hz resulting in a mass resolution of ~1 ag (1 ag = 10-18 g in air conditions.

Integration of RF-MEMS resonators on submicrometric commercial CMOS technologies

Integration of electrostatically driven and capacitively transduced MEMS resonators in commercial CMOS technologies is discussed. A figure of merit to study the performance of different structural layers and different technologies is defined. High frequency (HF) and very high frequency (VHF) resonance MEMS metal resonators are fabricated on a deep submicron 0.18 µm commercial CMOS technology and are characterized using electrical tests without amplification, demonstrating the applicability of the MEMS fabrication process for future technologies. Moreover, the fabricated devices show comparable performance in terms of Q × fres with previously presented MEMS resonators, whereas the small gap allows obtaining a low motional resistance with a single resonator approach.

Integrated CMOS-MEMS with on-chip readout electronics for high-frequency applications

A bridge-shaped first-lateral-mode 60-MHz mechanical resonator, which is monolithically integrated with capacitive CMOS readout electronics, is presented. The resonator is fabricated directly on a commercial CMOS technology using the top metal level as a structural layer. A maskless single-step wet-etching process for mechanical structure release after the standard CMOS integration process is the only postfabrication requirement. Electrical characterization of the electromechanical device demonstrates the feasibility of implementing a CMOS-microelectromechanical system for high-frequency applications using a standard conventional CMOS technology.

Design, fabrication, and characterization of a submicroelectromechanical resonator with monolithically integrated CMOS readout circuit

In this paper, we report on the main aspects of the design, fabrication, and performance of a microelectromechanical system constituted by a mechanical submicrometer scale resonator (cantilever) and the readout circuitry used for monitoring its oscillation through the detection of the capacitive current. The CMOS circuitry is monolithically integrated with the mechanical resonator by a technology that allows the combination of standard CMOS processes and novel nanofabrication methods. The integrated system constitutes an example of a submicroelectromechanical system to be used as a cantilever-based mass sensor with both a high sensitivity and a high spatial resolution (on the order of 10/sup -18/ g and 300 nm, respectively). Experimental results on the electrical characterization of the resonance curve of the cantilever through the integrated CMOS readout circuit are shown.

Monolithic mass sensor fabricated using a conventional technology with attogram resolution in air conditions

Monolithic mass sensors for ultrasensitive mass detection in air conditions have been fabricated using a conventional 0.35μm complementary metal-oxide-semiconductor (CMOS) process. The mass sensors are based on electrostatically excited submicrometer scale cantilevers integrated with CMOS electronics. The devices have been calibrated obtaining an experimental sensitivity of 6×10−11g∕cm2Hz equivalent to 0.9ag∕Hz for locally deposited mass. Results from time-resolved mass measurements are also presented. An evaluation of the mass resolution have been performed obtaining a value of 2.4×10−17g in air conditions, resulting in an improvement of these devices from previous works in terms of sensitivity, resolution, and fabrication process complexity.

A CMOS–MEMS RF-Tunable Bandpass Filter Based on Two High-

This letter presents the design, fabrication, and demonstration of a CMOS-MEMS filter based on two high-Q submicrometer-scale clamped-clamped beam resonators with resonance frequency around 22 MHz. The MEMS resonators are fabricated with a 0.35-mum CMOS process and monolithically integrated with an on-chip differential amplifier. The CMOS-MEMS resonator shows high-quality factors of 227 in air conditions and 4400 in a vacuum for a bias voltage of 5 V. In air conditions, the CMOS-MEMS parallel filter presents a programmable bandwidth from 100 to 200 kHz with a <1-dB ripple. In a vacuum, the filter presents a stop-band attenuation of 37 dB and a shape factor as low as 2.5 for a CMOS-compatible bias voltage of 5 V, demonstrating competitive performance compared with the state of the art of not fully integrated MEMS filters.

Q

A mass sensor based on thin-film bulk acoustic resonator, intended for biomolecular applications, is presented. The thin film is a (002) AlN membrane, sputtered over Ti∕Pt on a (001) Si wafer, and released by surface micromachining of silicon. Two experiments are proposed to test the mass sensing performance of the resonators: (a) distributed loading with a MgF2 film by means of physical vapor deposition and (b) localized mass growing of a C∕Pt∕Ga composite using focused-ion-beam-assisted deposition, both on the top electrode. For the distributed and localized cases, the minimum detectable mass changes are 1.58×10−8g∕cm2 and 7×10−15g, respectively.

22-MHz Polysilicon Clamped-Clamped Beam Resonators

The development and in vivo test of a fully integrated differential CMOS amplifier, implemented with standard 0.7-/spl mu/m CMOS technology (one poly, two metals, self aligned twin-well CMOS process) intended to record extracellular neural signals is described. In order to minimize the flicker noise generated by the CMOS circuitry, a chopper technique has been chosen. The fabricated amplifier has a gain of 74 dB, a bandwidth of 3 kHz, an input noise of 6.6 nV/(Hz)/sup 0.5/, a power dissipation of 1.3 mW, and the active area is 2.7 mm/sup 2/. An ac coupling has been used to adapt the electrode to the amplifier circuitry for the in vivo testing. Compound muscle action potentials, motor unit action potentials, and compound nerve action potentials have been recorded in acute experiments with rats, in order to validate the amplifier.

Localized and distributed mass detectors with high sensitivity based on thin-film bulk acoustic resonators

Keywords: mass sensors ; nanoelectromechanical systems ; nanolithography ; nanomechanical sensors ; High-Frequency Applications ; Cmos-Mems ; Devices Reference LMIS1-ARTICLE-2009-006doi:10.1002/smll.200990007View record in Web of Science Record created on 2009-01-28, modified on 2017-05-10

Integrated CMOS amplifier for ENG signal recording

This paper presents the design, fabrication and characterization of microresonators exhibiting resonance frequencies in the VHF and UHF bands, fabricated using the available layers of the standard and commercial CMOS technology, AMS-0.35mum. The resonators are released in a post-CMOS process consisting on a maskless wet etching. A clamped-clamped beam with resonance frequency of 290 MHz exhibiting Q-factors of 970 in air and 2836 in vacuum is presented. The fabrication and design of a ring bulk acoustic resonator (RBAR) designed to operate at 1 GHz is described. Preliminary results on the electrical characterization show a resonance frequency of 1.04 GHz and a quality factor of 400 in air.