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Ai-Tee Ang

TSMC

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Publication

Featured researches published by Ai-Tee Ang.

Archive | 2012

PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL AND METHOD OF FORMING THE SAME

Meng-Tse Chen; Kuei-Wei Huang; Tsai-Tsung Tsai; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2012

Fine-pitch package-on-package structures and methods for forming the same

Cheng-Chung Lin; Kuei-Wei Huang; Ai-Tee Ang; Tsai-Tsung Tsai; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Package-on-Package Joint Structure with Molding Open Bumps

Meng-Tse Chen; Chun-Cheng Lin; Wei-Yu Chen; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Fine Pitch Package-on-Package Structure

Tsai-Tsung Tsai; Chun-Cheng Lin; Ai-Tee Ang; Yi-Da Tsai; Ming-Da Cheng; Chung-Shi Liu

Archive | 2012

WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE

Meng-Tse Chen; Wei-Hung Lin; Kuei-Wei Huang; Tsai-Tsung Tsai; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2013

Methods for Metal Bump Die Assembly

Hsiu-Jen Lin; Ai-Tee Ang; Yu-Jen Tseng; Yu-Peng Tsai; Ming-Da Cheng; Chung-Shi Liu

Archive | 2016

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Ai-Tee Ang; Hsiu-Jen Lin; Wei-Hung Lin; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices

Hsiu-Jen Lin; Wei-Yu Chen; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Reflow Process and Tool

Ai-Tee Ang; Hsiu-Jen Lin; Cheng-Ting Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Halbleiterverarbeitungsschiffchen-design mit drucksensor Halbleiterverarbeitungsschiffchen design with pressure sensor

Ai-Tee Ang; Hsiu-Jen Lin; Wei-Hung Lin; Ming-Da Cheng; Chung-Shi Liu

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Collaboration

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Chung-Shi Liu

TSMC

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Ming-Da Cheng

TSMC

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Tsai-Tsung Tsai

TSMC

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Hsiu-Jen Lin

TSMC

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Chun-Cheng Lin

TSMC

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Kuei-Wei Huang

TSMC

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Meng-Tse Chen

TSMC

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Wei-Hung Lin

TSMC

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Yi-Da Tsai

TSMC

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Wei-Yu Chen

TSMC

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