Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Ai-Tee Ang is active.

Publication


Featured researches published by Ai-Tee Ang.


Archive | 2012

PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL AND METHOD OF FORMING THE SAME

Meng-Tse Chen; Kuei-Wei Huang; Tsai-Tsung Tsai; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu


Archive | 2012

Fine-pitch package-on-package structures and methods for forming the same

Cheng-Chung Lin; Kuei-Wei Huang; Ai-Tee Ang; Tsai-Tsung Tsai; Ming-Da Cheng; Chung-Shi Liu


Archive | 2014

Package-on-Package Joint Structure with Molding Open Bumps

Meng-Tse Chen; Chun-Cheng Lin; Wei-Yu Chen; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu


Archive | 2014

Fine Pitch Package-on-Package Structure

Tsai-Tsung Tsai; Chun-Cheng Lin; Ai-Tee Ang; Yi-Da Tsai; Ming-Da Cheng; Chung-Shi Liu


Archive | 2012

WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE

Meng-Tse Chen; Wei-Hung Lin; Kuei-Wei Huang; Tsai-Tsung Tsai; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu


Archive | 2013

Methods for Metal Bump Die Assembly

Hsiu-Jen Lin; Ai-Tee Ang; Yu-Jen Tseng; Yu-Peng Tsai; Ming-Da Cheng; Chung-Shi Liu


Archive | 2016

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Ai-Tee Ang; Hsiu-Jen Lin; Wei-Hung Lin; Ming-Da Cheng; Chung-Shi Liu


Archive | 2014

Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices

Hsiu-Jen Lin; Wei-Yu Chen; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu


Archive | 2014

Reflow Process and Tool

Ai-Tee Ang; Hsiu-Jen Lin; Cheng-Ting Chen; Ming-Da Cheng; Chung-Shi Liu


Archive | 2014

Halbleiterverarbeitungsschiffchen-design mit drucksensor Halbleiterverarbeitungsschiffchen design with pressure sensor

Ai-Tee Ang; Hsiu-Jen Lin; Wei-Hung Lin; Ming-Da Cheng; Chung-Shi Liu

Researchain Logo
Decentralizing Knowledge