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Ming-Da Cheng

TSMC

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Publication

Featured researches published by Ming-Da Cheng.

Archive | 2011

Packaging Methods and Structures for Semiconductor Devices

Chih-Wei Lin; Ming-Da Cheng; Wen-Hsiung Lu; Hsiu-Jen Lin; Bor-Ping Jang; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu; Meng-Tse Chen; Chun-Cheng Lin; Yu-Peng Tsai; Kuei-Wei Huang; Wei-Hung Lin

Archive | 2012

Mechanisms for forming copper pillar bumps using patterned anodes

Wen-Hsiung Lu; Ming-Da Cheng; Chih-Wei Lin; Chung-Shi Liu

Archive | 2012

PACKAGING WITH INTERPOSER FRAME

Hui-min Huang; Yen-Chang Hu; Chih-Wei Lin; Ming-Da Cheng; Chung-Shi Liu; Chen-Shien Chen

Archive | 2010

Mechanisms for forming copper pillar bumps

Ming-Da Cheng; Wen-Hsiung Lu; Chih-Wei Lin; Ching-Wen Chen; Yi-Wen Wu; Chia-Tung Chang; Ming-Che Ho; Chung-Shi Liu

Archive | 2010

Cu pillar bump with electrolytic metal sidewall protection

Wen-Hsiung Lu; Ming-Da Cheng; Chih-Wei Lin; Jacky Chang; Chung-Shi Liu; Chen-Hua Yu

Archive | 2014

Packaging methods and packaged semiconductor devices

Meng-Tse Chen; Wei-Hung Lin; Yu-Peng Tsai; Chun-Cheng Lin; Chih-Wei Lin; Ming-Da Cheng; Chung-Shi Liu

Archive | 2012

Package-On-Package (PoP) Structure and Method

Chen-Hua Yu; Mirng-Ji Lii; Chung-Shi Liu; Ming-Da Cheng

Archive | 2011

Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers

Wen-Hsiung Lu; Ming-Da Cheng; Chih-Wei Lin; Yi-Wen Wu; Hsiu-Jen Lin; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2013

Interconnect Structures and Methods of Forming Same

Wen-Hsiung Lu; Hsuan-Ting Kuo; Tsung-Yuan Yu; Hsien-Wei Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2010

CONDUCTIVE PILLAR FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE

Wen-Hsiung Lu; Ming-Da Cheng; Chih-Wei Lin; Ming-Che Ho; Chung-Shi Liu

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Collaboration

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Chung-Shi Liu

TSMC

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Chih-Wei Lin

TSMC

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Chen-Hua Yu

TSMC

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Meng-Tse Chen

TSMC

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Wen-Hsiung Lu

TSMC

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Hsiu-Jen Lin

TSMC

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Wei-Hung Lin

TSMC

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Chun-Cheng Lin

TSMC

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Kuei-Wei Huang

TSMC

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Wei-Yu Chen

TSMC

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