Akihiko Fujisaki

Packaging technology for high performance CMOS server Fujitsu GS8900

Advanced packaging technologies for CMOS based high performance Fujitsu Global Server GS8900, released in late 1999, are introduced in this paper. Extending a new standard for technological leadership among large-scale enterprise servers, the GS8900 broke the 2000 MIPS barrier in performance for the first time by taking advantages of Fujitsu advanced 0.18 /spl mu/m copper wiring process and chip/MCM/system packaging capabilities, delivering a doubled performance in comparison to its predecessor. The packaging technologies are uniquely characterized in several aspects. First, the high density stacked via type MCM-D technology features four pairs of CPU tightly coupled multiprocessor and large capacity second caches, the maximum processor terminal count is more than 10,000. The processors are wired onto a multilayer thin film MCM substrate with 153 /spl mu/m pitch high-density area array lead-free bumps. Secondly, maximum four CPU-MCMs, including 16 CPU processors, and 64 GB main memory modules are mounted on one multilayer system board of high frequency transmission properties. Each MCM is held through a high-density ZIF connector of around 3000 I/Os in a 1.27 mm pitch full matrix, which is assembled on the system board with lead-free solders. Thirdly, advanced cooling technologies are developed for improving the system performance and reliability.

MCM and bare chip technology for a wide range of computers

For a versatile MCM packaging technology with bare chip interconnection, an adequate patterned substrate and efficient cooling have been developed. A lineup of MCMs from a high-end supercomputer to a low-end portable PC are arranged by the combination of flip-chip and substrate technologies. More than thirty kinds of MCMs have been developed and are in production. These MCMs are classified into MCM-D and MCM-L, which are applied to both bare flip-chip devices of area bump and peripheral bump type. This effective combination of MCM technology for a wide range computers is discussed in this paper.