Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Akio Idei is active.

Publication


Featured researches published by Akio Idei.


ASME/JSME 2011 8th Thermal Engineering Joint Conference | 2011

A Design for Loop Thermosyphon Including Effect of Non-Condensable Gas

Hiroyuki Toyoda; Tadakatsu Nakajima; Yoshihiro Kondo; Akio Idei; Shigemasa Sato

We have developed a loop thermosyphon for cooling electronics devices. Its cooling performance changes with the ambient temperature and amount of input heating. Especially it deteriorates with non-condensable gas (NCG) increase. NCG leakage of thermosyphon cannot detect below under 10−10 Pa-m3 /s, though we have to design the thermosyphon considering these characteristics to provide guaranteed performance for 5–10 years. In this study, the effect of the amount of NCG in each component of a thermosyphon was measured while changing the amount of heater input, and the amount of NCG. As a result, we obtained some useful design information. The performance of air cooling part does not depend on the NCG amount in this case. The performance of evaporation part depends on the total pressure that includes the partial pressure of vapor and the partial pressure of NCG. The performance of condensation part is deteriorated strongly by NCG amount increase. Additionally, we expressed these performances as approximations. These expressions let us predict the total thermal resistance of this thermosyphon by the NCG amount and the input heating amount. Then, using the leakage of a thermosyphon and the amount of dissolved NCG in water, we predicted the amount of NCG that will be in the thermosyphon after 10 years. These results also let us predict the thermosyphon’s total thermal resistance after 10 years. Though there is a slight leakage on thermosyphon, using this technique, we are able to design a thermosyphon that is guaranteed the cooling performance for a long term.Copyright


Archive | 1993

Apparatus for cooling semiconductor device and computer having the same

Noriyuki Ashiwake; Tadakatsu Nakajima; Shigeyuki Sasaki; Yasuo Ohsone; Toshio Hatada; Toshiki Iino; Kenichi Kasai; Akio Idei


Archive | 1993

Liquid-cooled electronic device

Shigeyuki Sasaki; Tadakatsu Nakajima; Noriyuki Ashiwake; Yasuo Ohsone; Toshio Hatada; Toshiki Iino; Akio Idei; Kenichi Kasai


Archive | 1995

Low thermal resistant, fluid-cooled semiconductor module

Keizo Kawamura; Noriyuki Ashiwake; Takahiro Daikoku; Akio Idei; Kenichi Kasai; Hideyuki Kimura; Atsuo Nishihara; Toshio Hatada; Shigeyuki Sasaki


Archive | 1995

Cooling device of multi-chip module

Takahiro Daikoku; Fumiyuki Kobayashi; Noriyuki Ashiwake; Kenichi Kasai; Keizou Kawamura; Akio Idei


Archive | 2010

Cooling system and electronic apparatus applying the same therein

Hiroyuki Toyoda; Tadakatsu Nakajima; Yoshihiro Kondo; Shigeyuki Sasaki; Akio Idei; Shigemasa Satoh


Archive | 2009

COOLING UNIT, ELECTRONIC APPARATUS RACK, COOLING SYSTEM, AND CONSTRUCTION METHOD THEREOF

Tomoyuki Miyazawa; Takeshi Araya; Akio Idei; Hiroshi Iwata; Kaname Ieta; Tsuyoshi Ebato


Archive | 2007

Light emitting diode (led) illumination device and liquid crystal display device using the same

Makoto Abe; Akio Idei; Kaoru Katayama; Makoto Kitano; Katsumi Kondo; Tetsutoyo Konno; Norio Nakazato; Shigeo Ohashi; 典生 中里; 昭男 出居; 誠 北野; 繁男 大橋; 薫 片山; 哲豊 紺野; 克己 近藤; 誠 阿部


Archive | 2009

Cooling device and electronic equipment including cooling device

Hiroyuki Toyoda; Akio Idei; Shigeyasu Tsubaki; Tadakatsu Nakajima; Yoshihiro Kondo; Tomoo Hayashi


Archive | 2001

Highly thermal conductive grease composition and cooling device using the same

Takao Uematsu; Yutaka Ito; Takahiro Daikoku; Akio Idei; Akihiro Yasuda

Collaboration


Dive into the Akio Idei's collaboration.

Researchain Logo
Decentralizing Knowledge