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Dive into the research topics where Akira Murai is active.

Publication


Featured researches published by Akira Murai.


Archive | 2010

Thermosetting resin composition, and prepreg, laminate and multi-layered printed wiring board using same

Hiroyuki Izumi; Tomohiko Kotake; Masato Miyatake; Akira Murai; Shin Takanezawa; Shinji Tsuchikawa; 信次 土川; 正人 宮武; 智彦 小竹; 曜 村井; 寛之 泉; 伸 高根沢


Archive | 2007

Thermosetting resin composition of semi-ipn-type compound material, and varnish, prepreg and metal-clad laminate board using the same

Kazutoshi Danseigen; Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; 和俊 彈正原; 曜 村井; 康之 水野; 大輔 藤本


Archive | 2005

Composite molded article for high-frequency electronic component and composition for producing composite molded article for high-frequency electronic component

Nobuhito Hamada; Hiroyuki Hayashi; Yoshitsugu Hirokawa; Yasuyuki Mizuno; Akira Murai; Hitoshi Nishino; Toshikazu Oda; Akira Omoda; Yasushi Shimada; Mitsuyuki Tsurumi; Koichi Yamaguchi; Kazunori Yamamoto; 俊和 小田; 浩一 山口; 和徳 山本; 靖 島田; 能嗣 広川; 曜 村井; 裕之 林; 康之 水野; 亘人 濱田; 仁 西野; 亮 面田; 光之 鶴見


Archive | 2009

Laminated board for wiring board and method of manufacturing the same, resin film for primer layer, and multilayer wiring board and method of manufacturing the same

Daisuke Fujimoto; Masaharu Matsuura; Akira Murai; Nobuyuki Ogawa; Shin Takanezawa; 信之 小川; 曜 村井; 雅晴 松浦; 大輔 藤本; 伸 高根沢


Archive | 2008

Method for producing resin varnish containing semi-ipn composite thermosetting resin, as well as resin varnish for printed wiring board, prepreg, and metal-clad laminate using the same

Kazutoshi Danseigen; Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; 和俊 彈正原; 曜 村井; 康之 水野; 大輔 藤本


Archive | 2007

Thermosetting resin composition of ipn type composite, and varnish, prepreg and metal-clad laminate using the same

Kazutoshi Danseigen; Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; 和俊 彈正原; 曜 村井; 康之 水野; 大輔 藤本


Archive | 2005

Metal foil with adhesive layer and metal clad laminated sheet

Kazutoshi Danseigen; Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; Nobuyuki Ogawa; 信之 小川; 和俊 彈正原; 曜 村井; 康之 水野; 大輔 藤本


Archive | 2011

Resin film for printed wiring board and method for manufacturing the same

Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; 曜 村井; 康之 水野; 大輔 藤本


Archive | 2010

THERMOSETTING INSULATING RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD, AND MULTILAYER PRINTED WIRING BOARD USING THE SAME

Tomohiko Kotake; Masato Miyatake; Akira Murai; Shin Takanezawa; Shinji Tsuchikawa; 信次 土川; 正人 宮武; 智彦 小竹; 曜 村井; 伸 高根沢


Archive | 2008

Thermosetting resin composition, and resin varnish for printed circuit board, prepreg and metal-clad laminate using the same

Kazutoshi Danseigen; Daisuke Fujimoto; Yasuyuki Mizuno; Akira Murai; 和俊 彈正原; 曜 村井; 康之 水野; 大輔 藤本

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