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Dive into the research topics where Yasuyuki Mizuno is active.

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Featured researches published by Yasuyuki Mizuno.


2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) | 2002

Low-transmission-loss modified cyanate ester materials for high-frequency applications

Daisuke Fujimoto; Yasuyuki Mizuno; Nozomu Takano; Shigeo Sase; Harumi Negishi; Takeshi Sugimura

Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.


Archive | 2002

Thermosetting resin composition and use thereof

Shinji Tsuchikawa; Kazuhito Kobayashi; Yasuyuki Mizuno; Daisuke Fujimoto; Nozomu Takano


Archive | 2008

Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

Daisuke Fujimoto; Yasuyuki Mizuno; Kazutoshi Danjoubara; Hikari Murai


Archive | 2003

Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same

Yasuyuki Mizuno; Daisuke Fujimoto; Hiroshi Shimizu; Kazuhito Kobayashi; Takayuki Sueyoshi


Archive | 2001

Resin composition having excellent dielectric characteristics, varnish manufactured thereby, manufacturing method of varnish, prepreg, and metal- clad laminated sheet

Daisuke Fujimoto; Yasuyuki Mizuno; Mare Takano; Kenichi Tomioka; 健一 富岡; 康之 水野; 大輔 藤本; 希 高野


Archive | 2001

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

Yasuyuki Mizuno; Daisuke Fujimoto; Kenichi Tomioka; Nozomu Takano


Archive | 1998

Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same

Shigeo Sase; Yasuyuki Mizuno; Takeshi Sugimura; Harumi Negishi


Archive | 2007

Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board

Daisuke Fujimoto; Yasuyuki Mizuno; Kazutoshi Danjobara; Hikari Murai


Archive | 2007

Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same

Yasuyuki Mizuno; Daisuke Fujimoto; Kazutoshi Danjobara; Hikari Murai


Archive | 2012

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Yasuyuki Mizuno; Daisuke Fujimoto; Kazutoshi Danjobara; Hikari Murai

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