Akira Ogura

A compact 25-Gbit/s × 4ch optical interconnect module with straddle-shaped optical and electrical interface

A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.

A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical sub-assembly (OSA) techniques. The OIM module provides high heat dissipation and high optical-coupling efficiency. Furthermore, the fabricated OIM successfully demonstrated 25-Gbit/s error-free multimode transmission.

Optical Intrusion Detection Sensor with Polarization Maintaining Fiber

An optical intrusion‐detection sensor based on a Sagnac interferometer has been developed for fence‐mounted perimeter security applications. The interferometer is completely made of polarization maintaining fiber and related components. This sensor has been adopted by some important institutions as part of their physical security systems.

A high-density 300-Gbit/s parallel optical interconnect module with efficient thermal dissipation characteristics

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical interconnect module (OIM) with a high efficiency heat radiation structure was fabricated using a thermal via structure. The prototype OIM successfully demonstrated 25-Gbit/s error-free multimode transmissions, and the optical device temperature was less than 80°C.