Kinya Yamazaki

25-Gb/s 100-m MMF Transmission Using a Prototype 1.3-

A prototype transceiver composed of a 1.3-μm-range lens-integrated laser diode and photodiode as well as a complementary metal-oxide-semiconductor (CMOS) laser diode driver and a CMOS transimpedance amplifier for high-speed optical interconnections was developed. It demonstrated 25-Gb/s error-free 100-m multimode fiber transmission, with power dissipation of only 9 mW/Gb/s, for the first time.

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A 25-Gb/s × 4-ch optical transceiver module was developed. To obtain a compact module, CMOS analog front-end ICs, a lens integrated connector, and small LGA package was applied. The module demonstrated 25-Gb/s error-free transmission.

-Range CMOS-Based Transceiver for Optical Interconnections

A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.

A 25-Gb/s × 4-Ch, 8 × 8 mm 2 , 2.8-mm thick compact optical transceiver module for on-board optical interconnect

A 25 Gb/s × 4-ch, 8 × 8 mm2 optical transceiver module for optical interconnection has been developed. To obtain a compact optical module suitable for chip-to-chip interconnection, a lens integrated connector, a small low temperature co-fired ceramic (LTCC) package, and a precise lens assembling technology were used. Experimental results showed that the proposed module can achieve 25 Gb/s error free transmission.

A compact 25-Gbit/s × 4ch optical interconnect module with straddle-shaped optical and electrical interface

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical sub-assembly (OSA) techniques. The OIM module provides high heat dissipation and high optical-coupling efficiency. Furthermore, the fabricated OIM successfully demonstrated 25-Gbit/s error-free multimode transmission.

A 25 Gb/s × 4-ch, 8 × 8 mm small size optical transceiver module for optical interconnection

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical interconnect module (OIM) with a high efficiency heat radiation structure was fabricated using a thermal via structure. The prototype OIM successfully demonstrated 25-Gbit/s error-free multimode transmissions, and the optical device temperature was less than 80°C.