Alan D. Knight

Featured elastomer design for connector applications

This paper discusses a molded elastomeric structure that has been developed for use in connector applications. With the use of elastomeric materials, several challenges occur such as: dimensional stability for a grid of contacts as the elastomer member is compressed; contact force distribution across a grid of electrical contacts supported by a homogeneous molded elastomeric member constrained by boundary conditions; compressive stiffness of the elastomer and its ability to accommodate actuation tolerances within a contact force range; and structural stability of slender elastomeric features when used to increase the elastomeric structures compliancy. As connector I/O and densities increase, use of elastomeric materials with flexible circuits to replace metallic spring and conductor combinations is increasing. One advantage of this combination is the ability to arrange the contacts into dense arrays. In addition to the physical geometry, the component set offers several advantages to the electrical designer, dielectric constant, characteristic impedance, etc.<<ETX>>

Surface-Soldered Pinless Module Connector

Innovation in chip design and manufacture produces an ever-increasing density in packaged circuits. This demands an increase in input/output (I/O) lines from module to printed circuit card/board. Improved wireability is also needed at the printed circuit card/board levels. Surface solder of Components allows the use of smaller vias and more lines per channel to help achieve that wireability. In addition, cost per interconnection is constantly under pressure for reduction. A pinless module interconnection system is described which addresses these concerns and outlines the design features and concepts involved in its operation. The connector uses a spring beam low-energy high-contact-stress noble metal electrical contact. The connector system features wipe for improved metal-to-metal contact, and it may be used in high density I/O grid arrangements. It is shown that a low-force, surface-soldered contact system can be used to produce a reliable high-density interconnec- tion.