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Alan James Emerick

IBM

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Publication

Featured researches published by Alan James Emerick.

Archive | 1999

High density integrated circuit packaging with chip stacking and via interconnections

Michael A. Gaynes; Alan James Emerick; Viswanadham Puligandla; Charles G. Woychik; Jerzy M. Zalesinski

Archive | 1991

Substrate soldering in a reducing atmosphere

Joseph Anthony Apap; Mark Alan Brown; Alan James Emerick; Thomas Lawrence Miller; James Richard Murray; David William Sissenstein

Archive | 1989

Solder paste for use in a reducing atmosphere

Peter Jarl Elmgren; Alan James Emerick; Dennis Louis Rivenburg; Mukund Kantilal Saraiya; David William Sissenstein

Archive | 1995

Process for fabricating an electronic circuit package

Jerzy M. Zalesinski; Alan James Emerick

Archive | 1987

Solder leveling method and apparatus

John P. Simpson; Gary Leigh Newman; James M. Larnerd; Alan James Emerick

Archive | 1990

Affixing pluggable pins to a ceramic substrate

Alan James Emerick; Eugene Lewis Marsh; Thomas Lawrence Miller; Jerzy M. Zalesinski

Archive | 1986

Solder leveling technique

Russell Elwood Darrow; Alan James Emerick; John David Larnerd

Archive | 1987

Method of solder leveling in a circuitized substrate

Russell Elwood Darrow; Alan James Emerick; John David Larnerd

Archive | 1991

Fastening of plug pins in ceramic substrates

Alan James Emerick; Eugene Lewis Marsh; Thomas Lawrence Miller; Jerzy M. Zalesinski

Archive | 1987

Method and apparatus for loetnivellierung.

John P. Simpson; Gary Leigh Newman; James M. Larnerd; Alan James Emerick

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Jerzy M. Zalesinski

IBM

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John David Larnerd

IBM

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Russell Elwood Darrow

IBM

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Thomas Lawrence Miller

IBM

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David William Sissenstein

IBM

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Eugene Lewis Marsh

IBM

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Gary Leigh Newman

IBM

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James M. Larnerd

IBM

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John P. Simpson

IBM

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Charles G. Woychik

IBM

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