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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Jerzy M. Zalesinski is active.

Publication


Featured researches published by Jerzy M. Zalesinski.


Archive | 1999

High density integrated circuit packaging with chip stacking and via interconnections

Michael A. Gaynes; Alan James Emerick; Viswanadham Puligandla; Charles G. Woychik; Jerzy M. Zalesinski


Archive | 2000

Through-chip conductors for low inductance chip-to-chip integration and off-chip connections

Claude L. Bertin; Wayne J. Howell; William R. Tonti; Jerzy M. Zalesinski


Archive | 2001

Rolling ball connector

Joseph A. Benenati; Claude L. Bertin; William T. Chen; Thomas Edward Dinan; Wayne F. Ellis; Wayne J. Howell; John U. Knickerbocker; Mark V. Pierson; William R. Tonti; Jerzy M. Zalesinski


Archive | 1996

Direct chip attachment (DCA) with electrically conductive adhesives

Richard Benton Booth; Michael A. Gaynes; Robert M. Murco; Viswanadham Puligandla; Judith Marie Roldan; Ravi F. Saraf; Jerzy M. Zalesinski


Archive | 1997

Electronic package assembly

Lawrence Richard Cutting; Michael A. Gaynes; Eric A. Johnson; Cynthia S. Milkovich; Jeffrey S. Perkins; Mark V. Pierson; Steven E. Poetzinger; Jerzy M. Zalesinski


Archive | 1999

Integrated heat exchanger for memory module

Richard Charles Dodge; Kenneth Haskell Earl; Gary D. Grise; Douglas R. Guild; Karl D. Loughner; Jerzy M. Zalesinski


Archive | 2002

Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality

Claude L. Bertin; Gordon Arthur Kelley; Dennis Arthur Schmidt; William R. Tonti; Jerzy M. Zalesinski


Archive | 1997

Method of manufacturing an integrated ULSI heatsink

William R. Tonti; Jack A. Mandelman; Jerzy M. Zalesinski; Toshiharu Furukawa; Son Van Nguyen; Dureseti Chidambarrao


Archive | 1995

Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits

Michael A. Gaynes; George D. Oxx; Mark V. Pierson; Jerzy M. Zalesinski


Archive | 1999

Enhanced heat-dissipating printed circuit board package

Stephen W. MacQuarrie; Randall J. Stutzman; Jerzy M. Zalesinski

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