Is this you? Create Your Porfile
Avatar

Jerzy M. Zalesinski

IBM

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Jerzy M. Zalesinski is active.

Explore More

Publication

Featured researches published by Jerzy M. Zalesinski.

Archive | 1999

High density integrated circuit packaging with chip stacking and via interconnections

Michael A. Gaynes; Alan James Emerick; Viswanadham Puligandla; Charles G. Woychik; Jerzy M. Zalesinski

Archive | 2000

Through-chip conductors for low inductance chip-to-chip integration and off-chip connections

Claude L. Bertin; Wayne J. Howell; William R. Tonti; Jerzy M. Zalesinski

Archive | 2001

Rolling ball connector

Joseph A. Benenati; Claude L. Bertin; William T. Chen; Thomas Edward Dinan; Wayne F. Ellis; Wayne J. Howell; John U. Knickerbocker; Mark V. Pierson; William R. Tonti; Jerzy M. Zalesinski

Archive | 1996

Direct chip attachment (DCA) with electrically conductive adhesives

Richard Benton Booth; Michael A. Gaynes; Robert M. Murco; Viswanadham Puligandla; Judith Marie Roldan; Ravi F. Saraf; Jerzy M. Zalesinski

Archive | 1997

Electronic package assembly

Lawrence Richard Cutting; Michael A. Gaynes; Eric A. Johnson; Cynthia S. Milkovich; Jeffrey S. Perkins; Mark V. Pierson; Steven E. Poetzinger; Jerzy M. Zalesinski

Archive | 1999

Integrated heat exchanger for memory module

Richard Charles Dodge; Kenneth Haskell Earl; Gary D. Grise; Douglas R. Guild; Karl D. Loughner; Jerzy M. Zalesinski

Archive | 2002

Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality

Claude L. Bertin; Gordon Arthur Kelley; Dennis Arthur Schmidt; William R. Tonti; Jerzy M. Zalesinski

Archive | 1997

Method of manufacturing an integrated ULSI heatsink

William R. Tonti; Jack A. Mandelman; Jerzy M. Zalesinski; Toshiharu Furukawa; Son Van Nguyen; Dureseti Chidambarrao

Archive | 1995

Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits

Michael A. Gaynes; George D. Oxx; Mark V. Pierson; Jerzy M. Zalesinski

Archive | 1999

Enhanced heat-dissipating printed circuit board package

Stephen W. MacQuarrie; Randall J. Stutzman; Jerzy M. Zalesinski

Explore More

Collaboration

Dive into the Jerzy M. Zalesinski's collaboration.

Top Co-Authors
Avatar

Michael A. Gaynes

IBM

View shared research outputs
Top Co-Authors
Avatar

Mark V. Pierson

IBM

View shared research outputs
Top Co-Authors
Avatar

William R. Tonti

IBM

View shared research outputs
Top Co-Authors
Avatar

Claude L. Bertin

IBM

View shared research outputs
Top Co-Authors
Avatar

Cynthia S. Milkovich

IBM

View shared research outputs
Top Co-Authors
Avatar

Eric A. Johnson

IBM

View shared research outputs
Top Co-Authors
Avatar

Jeffrey S. Perkins

IBM

View shared research outputs
Top Co-Authors
Avatar

Lawrence Richard Cutting

IBM

View shared research outputs
Top Co-Authors
Avatar

Steven E. Poetzinger

IBM

View shared research outputs
Top Co-Authors
Avatar

Alan James Emerick

IBM

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge