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Dive into the research topics where Allan R. Knoll is active.

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Featured researches published by Allan R. Knoll.


Journal of Adhesion Science and Technology | 1994

Oxygen plasma modification of polyimide webs: effect of ion bombardment on metal adhesion

Frank D. Egitto; Kim J. Blackwell; Allan R. Knoll

Webs of Kapton 200-H and Upilex-S polyimide films were treated using oxygen plasma prior to sequential sputter deposition of chromium and copper in a roll metallization system. Two plasma system configurations were employed for treatment. In one configuration, the sample traveled downstream from a microwave plasma; in the other, the web moved through a DC-generated glow discharge. For the DC-glow treatment, the potential difference between the plasma and the web, Φf, and relative ion densities, n+, were measured at various values of chamber pressure and DC power using a Langmuir probe. Although samples treated downstream from the microwave plasma were not subjected to bombardment by energetic ions, Φf for the DC-glow operating conditions was between 5 and 13 eV. For both films, advancing DI water contact angles of less than 20° were achieved using both modes of treatment. Contact angles for untreated films were greater than 60°. However, 90° peel tests yielded values of 15 to 20 g/mm for microwave plasma ...


Archive | 1992

Process for creating organic polymeric substrate with copper

Kim J. Blackwell; Allan R. Knoll


Archive | 1991

Method for metallizing through holes in thin film substrates, and resulting devices

Kim J. Blackwell; Pei C. Chen; Stephen E. Deliman; Allan R. Knoll; George J. Matarese; Richard D. Weale


Archive | 1997

Method of forming adherent metal components on a polyimide substrate

Kim J. Blackwell; Frank D. Egitto; Allan R. Knoll


Archive | 1995

High adhesion performance roll sputtered strike layer

Kim J. Blackwell; Pei Cheh Chen; Frank D. Egitto; Allan R. Knoll; George J. Matarese


Archive | 1991

Electronic package including lower water content polyimide film

Kim J. Blackwell; Pei C. Chen; Frank D. Egitto; Allan R. Knoll; George J. Matarese


Archive | 1994

Process for coating a substrate with metallic layer

Kim J. Blackwell; Pei Cheh Chen; Allan R. Knoll; Richard D. Weale


Archive | 1989

Method of plasma etching a substrate with a gaseous organohalide compound

Suryadevara V. Babu; Joseph Gerard Hoffarth; Allan R. Knoll; Walter E. Mlynko; John F. Rembetski; Kenneth D. Mack


Surface and Interface Analysis | 1990

Surface reactions of copper films in O2/CF4/N2 plasmas

D. D. Coolbaugh; Frank D. Egitto; Allan R. Knoll


Archive | 1990

Method of plasma etching a substrate

Suryadevara V. Babu; Joseph Gerard Hoffarth; Allan R. Knoll; Walter E. Mlynko; John F. Rembetski

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