Kim J. Blackwell

Oxygen plasma modification of polyimide webs: effect of ion bombardment on metal adhesion

Webs of Kapton 200-H and Upilex-S polyimide films were treated using oxygen plasma prior to sequential sputter deposition of chromium and copper in a roll metallization system. Two plasma system configurations were employed for treatment. In one configuration, the sample traveled downstream from a microwave plasma; in the other, the web moved through a DC-generated glow discharge. For the DC-glow treatment, the potential difference between the plasma and the web, Φf, and relative ion densities, n+, were measured at various values of chamber pressure and DC power using a Langmuir probe. Although samples treated downstream from the microwave plasma were not subjected to bombardment by energetic ions, Φf for the DC-glow operating conditions was between 5 and 13 eV. For both films, advancing DI water contact angles of less than 20° were achieved using both modes of treatment. Contact angles for untreated films were greater than 60°. However, 90° peel tests yielded values of 15 to 20 g/mm for microwave plasma ...

High reliability BGA package improvements on module total cost of ownership

This paper describes mechanical reliability and relative cost comparisons from the system ownership point of view. Total system cost performance of a PTFE based organic ball grid array chip package is compared, on a relative basis, to that obtained with other BGA packages having organic as well as ceramic technologies. Mechanical reliability performance values obtained in common reliability testing are projected to field usage performance, and compared across these various package types. The paper discusses the results for large body sizes and large die sizes, where interesting trends are noted. Considering the various package types and sizes, this study identifies primary assembly (to printed wiring board) costs, on a relative basis, including standard BGA assembly, land grid array with sockets, and column grid array. Combining this assembly data with package reliability projections, a simple guide is provided for the total cost of ownership over a period of time. Further refinement, including system availability and service costs, is discussed.

ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION

High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decrea...