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Dive into the research topics where Alodeep Sanyal is active.

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Featured researches published by Alodeep Sanyal.


international on line testing symposium | 2008

A Built-In Self-Test Scheme for Soft Error Rate Characterization

Alodeep Sanyal; Syed M. Alam; Sandip Kundu

Soft errors caused by ionizing radiation have emerged as a major concern for current generation of CMOS technologies and the trend is expected to get worse. Soft error rate (SER) measurement, expressed as number of failures encountered per billion hours of device operation, is time consuming and involves significant test cost. The cost stems from having to connect a device-under-test to a tester for extended period of time. While built-in self-test (BIST) mechanisms have been around for over a decade, that minimizes the use of a tester; they have not been applied to measure or characterize soft error rate. This is because traditional BIST methods cannot distinguish between a soft failure and a hard failure and have no provision for counting the number of errors. In this paper, we propose a BIST design for soft error rate (SER) characterization, which obviates those issues. The proposed BIST based SER measurement scheme can be further accelerated by improved controllability and observability while unlike traditional BIST schemes, a test by test failure detection capability enables higher diagnostic resolution for single event based transient errors. We further propose to integrate this chip-level BIST-based SER characterization system with a distributed on-line scheme using a network controller that tests multiple chips in parallel and completely eliminates the need for a tester. The hardware overhead of the proposed architecture is small and it becomes insignificant for larger design.


international symposium on quality electronic design | 2007

On Accelerating Soft-Error Detection by Targeted Pattern Generation

Alodeep Sanyal; Kunal P. Ganeshpure; Sandip Kundu

Soft error due to ionizing radiation is emerging as a major concern for future technologies. The measurement unit for failures due to soft errors is called failure-in-time (FIT) that represents the number of failures encountered per billion hours of device operation. FIT rate measurement is time consuming and calls for accelerated testing. There are multiple ways to accelerate soft error rate (SER) testing. Acceleration by increasing radiation and lowering supply voltage has been reported. In this paper we propose increasing the rate of failure due to soft error by intelligent pattern selection. The proposed approach is based on the fact that all circuit nodes are not equally susceptible to faults due to soft error. We propose a pattern selection technique which specifically targets the most vulnerable nodes in the circuit and construct a test set to maximize failure rate due to soft error. The solution is based on a combination of ILP and fault simulation techniques. The test set thus derived can be applied repeatedly to accelerate the soft error rate testing. Results based on ISCAS circuits show that it is possible to achieve 10times acceleration by this technique


international conference on vlsi design | 2007

An Efficient Technique for Leakage Current Estimation in Sub 65nm Scaled CMOS Circuits Based on Loading Effect

Ashesh Rastogi; Wei Chen; Alodeep Sanyal; Sandip Kundu

With scaling of CMOS technologies, sub-threshold, gate and reverse biased junction band-to-band-tunneling leakage have increased dramatically. Together they account for more than 25% of power consumption in the current generation of leading edge designs. Different sources of leakage can affect each other by interacting through resultant intermediate node voltages. This is called the loading effect. In this paper, the authors propose a pattern dependent steady state leakage estimation technique that incorporates loading effect and accounts for all three major leakage components, namely the gate, band to band tunneling and sub-threshold leakage and accounts for transistor stack effect. The proposed estimation technique has been validated against SPICE and can be deployed on larger circuits where SPICE simulation is infeasible. In this paper, we report a speed up of 2,000-70,000times speed-up over SPICE simulation on smaller circuits, where spice simulation is feasible. Further results show that loading effect is a significant factor in leakage that worsens with technology scaling


IEEE Transactions on Computers | 2010

An Efficient Technique for Leakage Current Estimation in Nanoscaled CMOS Circuits Incorporating Self-Loading Effects

Alodeep Sanyal; Ashesh Rastogi; Wei Chen; Sandip Kundu

With the scaling of CMOS technology, subthreshold, gate, and reverse biased junction band-to-band-tunneling leakage have increased dramatically. Together, they account for more than 25 percent of power consumption in the current generation of leading edge designs. Different sources of leakage can affect each other by interacting through resultant intermediate node voltages. This is called the loading effect. In this paper, we propose a pattern dependent steady-state leakage estimation technique that incorporates loading effect and accounts for all three major leakage components, namely the gate, band-to-band-tunneling, and subthreshold leakage and accounts for transistor stack effect. By observing a recursive relationship between gate leakage and loading effect, we further refine our leakage estimation technique by developing a compact leakage model that supports iteration over node voltages based on Newton-Raphson method. The proposed estimation technique based on the compact model improves performance and capacity over SPICE. We report a speedup of 18,000X over SPICE simulation on smaller circuits, where SPICE simulation is feasible. Results also show that loading effect is a significant factor in leakage and worsens with technology scaling.


IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | 2009

An Improved Soft-Error Rate Measurement Technique

Alodeep Sanyal; Kunal P. Ganeshpure; Sandip Kundu

Soft errors caused by ionizing radiation have emerged as a major concern for current generation of CMOS technologies, and the trend is expected to get worse. The measurement unit for failures due to soft errors is failure in time (FIT) that represents the number of failures encountered per billion hours of device operation. FIT rate measurement is time consuming and calls for accelerated testing. To improve effectiveness of soft-error rate (SER) testing, the patterns must be targeted toward detecting node failures that are most likely. In this paper, we present a technique for identifying soft-error-susceptible sites based on efficient electrical analysis that treats soft errors as Boolean errors but uses analog strengths to decide whether such errors can propagate to the next stage. Next, we present pattern generation techniques for manifestable soft errors such that each pattern targets a maximal set of soft errors. These patterns maximize the likelihood of detecting a soft error when it occurs. The pattern generators target scan architecture. It is well known that scan test time is dominated by scan shifts, when no useful testing is being done. To improve efficiency of scan-based testing, we extend the functionality of the existing built-in logic block observation (BILBO) architecture to support test-per-clock operation. Such targeted pattern generation and test application improve SER characterization time by an order of magnitude.


design, automation, and test in europe | 2008

On modeling and testing of lithography related open faults in nano-CMOS circuits

Aswin Sreedhar; Alodeep Sanyal; Sandip Kundu

Scaling of transistor feature size over time has been facilitated by corresponding improvement in lithography technology. However, in recent times the wavelength of the optical light source used for photolithography has not scaled in the same rate as that of the minimum feature size of the transistor. In fact, starting with 180 nm devices, the wavelength of optical source has remained the same (at 193 nm) due to difficulties in finding a flicker-free, high energy, coherent light source with compatible improvement in lens material for focusing this light. Consequently, upcoming technology nodes (65 nm, 45 nm, 32 nm and 22 nm) will be using a light source with wavelength much greater than the feature size. This creates a peculiar problem where line width on manufactured devices is a function of relative spacing between adjacent lines. Despite numerous restriction on layout rules, interconnects may still suffer from constriction due to this peculiarity also known as forbidden pitch problem. A small manufacturing variation turns the constrictions to open faults. Gate leakage current is a significant concern for present and upcoming technology nodes. Due to gate leakage, an open fault is not truly an open circuit. Our simulation studies show that the leakage current steers the floating input of a gate to certain meta- stable states. This property actually makes it easier to detect open faults either through side channel excitation or by stuck-at tests. The major contributions of this paper are (i) lithographic simulation based identification of potential open fault sites, (ii) identification of meta-stable input states for these open inputs, (iii) length calculation for side channel signals for definitive detection of open faults. Together, they provide a complete CAD framework for testing lithography related open faults.


international conference on computer design | 2006

A Pattern Generation Technique for Maximizing Power Supply Currents

Kunal P. Ganeshpure; Alodeep Sanyal; Sandip Kundu

Max-current analysis is essential in power rail design and power supply switching noise analysis. Traditionally, maximum current from all CMOS gates are added together to compute maximum current level. This approach ignores all Boolean relationships. The problem of finding the input vector pair that will cause worst case current draw from the power rails when Boolean relationships are considered is an NP-hard problem. In this paper, we propose a Current Maximizing Pattern Generation (CMPG) algorithm which greatly reduces the computational complexity by using a parameterized branch-and-bound heuristic that prunes the search space by looking for a lower as well as an upper bound for maximum switching currents. When allowed to proceed indefinitely, the CMPG algorithm converges on an exact solution instead of finding upper and lower bounds. When coupled with a switch level SAT solver, CMPG can generate patterns for cell library characterization.


IEEE Transactions on Very Large Scale Integration Systems | 2012

Test Pattern Generation for Multiple Aggressor Crosstalk Effects Considering Gate Leakage Loading in Presence of Gate Delays

Alodeep Sanyal; Kunal P. Ganeshpure; Sandip Kundu

Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susceptible to signal integrity related failures. Capacitive crosstalk on long signal nets is of particular concern. A typical long net is capacitively coupled with multiple aggressors and also tend to have multiple fan-outs. Gate leakage current that originates in fan-out receivers, terminates in the driver causing a shift in driver output voltage. This effect becomes more prominent as gate oxide is scaled more aggressively. Thus, in nano-scale CMOS circuits, noise margin gets eroded by both aggressor crosstalk noise as well as gate leakage loading from fan-outs. In this paper, we present an automatic test pattern generation solution which uses 0-1 integer linear programming to maximize the cumulative voltage noise at a given victim net because of crosstalk and loading in conjunction with propagating the fault effect to an observation point. The target ISCAS benchmark circuits are assumed to have unit gate delays. Results demonstrate both the viability of a solution as well as a need to consider both sources of noise for signal integrity analysis. Pattern pairs generated by this technique are useful for both manufacturing test application as well as signal integrity verification.


international symposium on quality electronic design | 2009

A study on impact of loading effect on capacitive crosstalk noise

Alodeep Sanyal; Abhisek Pan; Sandip Kundu

Decreasing process geometries and increasing operating frequencies have made VLSI circuits more susceptible to signal integrity related failures. Capacitive crosstalk is one of the major causes for such kind of failures. Typically, crosstalk faults result from switching of neighboring lines that are capacitively coupled. As we move deep into nanometer regime, transistor gate leakage introduces considerable voltage noise in internal circuit nodes. This phenomenon is known as loading effect. The objective of this paper is to study the impact of this voltage noise on capacitive cross-talk related signal integrity problems. A simplified cross-talk analysis system assumes that all aggressors of a net can switch at the same time. This leads to excessive pessimism that can be reduced by considering the timing window of aggressor switching as well as their Boolean relationships. In order to evaluate the impact of loading effect on cross-talk noise, we devised a dynamic simulator that performs dynamic timing simulation. By performing simulations on ISCAS-85 benchmark circuits we established that loading effect is a significant aggravator of cross-talk noise that leads to increased number of failures. The main contributions of this paper are (i) showing that loading effect worsens cross-talk related signal integrity problems and (ii) an efficient dynamic timing simulator for simulating crosstalk effects that provide a quantities measure.


international on-line testing symposium | 2007

On Derating Soft Error Probability Based on Strength Filtering

Alodeep Sanyal; Sandip Kundu

Soft errors caused by ionizing radiation have emerged as a major concern for current generation of CMOS technologies and the trend is expected to get worse. A significant fraction of soft errors in semiconductor has been reported to never lead to a system failure. System level soft-error rate (SER) analysis shows that soft-error in internal circuit nodes frequently fail to propagate to an observable point due to Boolean filtering and latching window filtering. A previous study shows that when soft-error is viewed as an analog signal distortion rather than a digital error, it often disappears during signal propagation due to error signal attenuation. This has been termed as electrical filtering. Electrical filtering in system level soft-error rate analysis is expensive because it involves circuit level simulation. In this paper, we present an electrical filtering technique that treats soft-errors as digital errors, but uses analog strengths to decide whether such errors can propagate. We call this technique strength filtering. Strength filtering does not involve SPICE simulation, hence it is computationally efficient. Used as a pre-processing step, strength filtering improves the efficiency of system level soft-error rate analysis. Experimental results on ISCAS-85 benchmark circuits show that an average of ~38% of the soft errors have no potential impact on the system level behavior and therefore, can be filtered out to improve both accuracy and efficiency of soft rate estimation process.

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Sandip Kundu

University of Massachusetts Amherst

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Kunal P. Ganeshpure

University of Massachusetts Amherst

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Ashesh Rastogi

University of Massachusetts Amherst

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Syed M. Alam

University of Massachusetts Amherst

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Abhisek Pan

University of Massachusetts Amherst

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Aswin Sreedhar

University of Massachusetts Amherst

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Wei Chen

University of Massachusetts Amherst

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