André Durier

Construction of an Integrated Circuit Emission Model of a FPGA

This paper describes the construction flow and the validation of an equivalent conducted emission model of a complex integrated circuit (a FPGA), based on the ICEM (Integrated Circuit Emission Model) modeling approach.

A methodologic project to characterize and model COTS components EMC behavior after ageing

The industries of transportation as the space industry are faced with a strong global economic competition which sets economic constraints on the cost of the functions. The use of COTS (Commercial Off-The-Shelf) components in embedded systems is more and more necessary to shorten the development cycles and reduce manufacturing costs. The application of electronic components comes overwhelmingly from public sectors whose requirement is to provide, in short development cycles, technological innovations including risk and cost mitigation. These development cycles must incorporate the specific constraints of embedded systems which are subject to strong normative requirements in terms of robustness and especially in terms of ElectroMagnetic Compatibility (EMC). In order to anticipate the risk of EMC non-compliance at electronic equipment level, the use of simulation tools and the development of EMC components models particularly at Integrated Circuits level has grown in recent years.

TCAD Simulation of the Single Event Effects in Normally-OFF GaN Transistors After Heavy Ion Radiation

Electrical behavior of normally-off GaN power transistors under heavy ion stress radiation is presented based on 2D-TCAD numerical simulation in order to better understand the mechanism of Single Event Effects (SEE) in this devices.

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses

Abstract Space and transport industries are facing a strong global competition which is setting economic constraints on the entire supply chain. In order to address decreasing development costs and to propose new features, components-off-the-shelf (COTS) have become a very attractive solution. This paper investigates the degradation of AlGaN/GaN HEMTs COTS submitted to HTRB lifetest. Temperature and voltage step stresses were applied to untangle the effect of each stressor. The main aim is to establish a lifetime model, taking into account several degradation mechanisms, over a large range of temperatures and voltages. The experimental outcomes highlight the activation of different failure mechanisms occurring during the stress tests, and which depend from the different temperature and voltage working ranges. In this work, experimental analysis has been performed in order to characterize the root cause behind the activation of these multiple failure mechanisms and estimate the operative range where they may superimpose.

A New Methodology to Build the Internal Activity Block of ICEM-CE for Complex Integrated Circuits

End-users of integrated circuits need models to anticipate and solve conducted emission issues at board level in a short time. The standard IEC62433-2 integrated circuit emission model—conducted emissions (ICEM-CE) has been proposed to respond to this demand. Although the standard proposes methods to extract circuit models from measurements, they cannot provide activity-dependent models and may lead to inaccurate results for large and complex circuits. This paper describes a new methodology of construction of the internal activity block of an ICEM-CE model adapted to large digital integrated circuits and validated on a field-programmable gate array. The method is based on a predictive approach using the estimation tools of the dynamic power and the data path delays proposed by the manufacturer of the integrated circuit.

Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach

Abstract In this paper, we develop a conducted immunity model based on ICIM-CI approach (Integrated Circuit Immunity Model Conducted Immunity) that takes into account the effect of ageing in the immunity characteristics of a bandgap voltage reference. The modelling approach is briefly described. Then the measurement setup and the ageing procedure are detailed. Finally, the model is established and validated thanks to measurements before and after ageing. This model allows to anticipate the long term electromagnetic compliance of the circuit.

A methodologic project to characterize and model COTS component reliability

The industries of transportation as the space industry are faced with a strong global economic competition which sets economic constraints on the cost of the functions. The use of COTS (Commercial Off-The-Shelf) components in embedded systems is more and more necessary to shorten the development cycles and reduce manufacturing costs. The application of electronic components comes overwhelmingly from public sectors whose requirement is to provide, in short development cycles, technological innovations including risk and cost mitigation. These development cycles must incorporate the specific constraints of embedded systems in terms of reliability, dependability, and availability, held in harsh environment and life. Due to the low volume of components supplying the market of embedded systems, component manufacturers are unlikely to provide information necessary to supporting folders for certification or qualification. It is therefore necessary for the Space, Aeronautics and Automotive industries to characterize the performance and robustness of these COTS components in the operational and environmental conditions of their applications. This paper presents the objectives and main challenges of a sponsored project dedicated to characterize and model COTS reliability.