Andre Zimmermann

Chip Embedding in Laminates

This chapter provides an overview of the technology of embedding chips into laminates. The motivation, an overview of technological approaches and the challenges will be outlined. One of the technologies will be described in more detail through a case of an application. Finally a technological outlook is given in consideration of the innovations the embedded technology could make possible.

Polymers in power electronics - Performance of thermal interface materials

Polymers are important enablers for electronic systems. Current trends and challenges for the application of polymers in electronics are described. The transition to electro mobility leads to rising power density of automotive electronics. Therefore, polymers with high thermal stability and excellent heat dissipation are required. Within the EU funded FP7 project NANOPACK, Bosch investigated different thermal greases on a specific demonstrator. The results are described and discussed with focus on thermal performance and reliability.

High-temperature deformation behavior of nanocrystalline precursor-derived Si–B–C–N ceramics in controlled atmosphere

Abstract In precursor-derived nanocrystalline Si–B–C–N materials, grain or interphase boundaries constitute a major part of the material. They control various properties of nanostructured solids, e.g., by forming fast diffusion pathways. In such highly covalent materials, where the interfaces between the individual crystallites or domains tend to be broadened and structurally disordered, high-temperature plastic deformation (i.e., the creep behavior) can be used as a probe which is particularly sensitive to processes involving internal interfaces and glass-like features of the microstructure. The focus of the present study is an investigation of the deformation behavior of precursor-derived nanocrystalline Si–B–C–N ceramics in the phase-separated amorphous and nanocrystalline states under inert atmospheres. A concise analysis of creep mechanisms free of any oxidation effects was carried out. Isothermal compression creep experiments at 1400°C and at various loads (50MPa–150MPa) have indicated a stress exponent near to unity hinting diffusion creep, and an activation energy of 0.16 ± 0.03 MJ/mol was derived from temperature change experiments under an iso-stress condition. The mechanisms of deformation are elucidated using a free volume model.