Andreas Grassmann

Double Sided Cooled Module concept for High Power Density in HEV Applications

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

Contact hole production by means of crossing sudden phase shift edges of a single phase mask

Optical sensor used as a photo diode or photo transistor comprises a substrate, an intermediate metal dielectric and a first antireflection layer arranged on the substrate, and a passivating layer arranged on the dielectric

Power Semiconductor Module With Current Sensor

Contact hole fabrication with the aid of mutually crossing sudden phase shift edges of a single phase shift mask

Control of critical dimensions

Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size

Method of Manufacturing a Cooler for Semiconductor Modules

Electronic Sub-Module Including a Leadframe and a Semiconductor Chip Disposed on the Leadframe