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Andreas Lenniger

Infineon Technologies

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Publication

Featured researches published by Andreas Lenniger.

Archive | 2013

Semiconductor device including cladded base plate

Andreas Lenniger; Andre Uhlemann; Olaf Hohlfeld

Archive | 2013

SEMICONDUCTOR DEVICE INCLUDING CLAD TYPE BASE PLATE

Olaf Hohlfeld; Andreas Lenniger; Andre Uhlemann

Archive | 2013

Halbleiteranordnung mit plattierter Basisplatte

Olaf Hohlfeld; Andreas Lenniger; Andre Uhlemann

Archive | 2011

Verfahren, mit dem ein Schaltungsträger hergestellt wird, und Verfahren zur Herstellung einer Halbleiteranordnung

Andreas Lenniger; Olaf Hohlfeld; Elmar Kühle

Archive | 2011

Circuit substrate for mounting semiconductor chip of e.g. semiconductor device, has filler metal that is partially filled in intermediate space provided between the ceramic materials

Andreas Lenniger; Olaf Hohlfeld; Elmar Kühle

Archive | 2005

Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink

Andreas Lenniger

Archive | 2006

Method, Device and System for Bonding a Semiconductor Element

Dirk Siepe; Reinhold Bayerer; Andreas Lenniger

Archive | 2013

Semiconductor module i.e. power semiconductor module, has base plate comprising thickened portion whose maximum thickness is greater than average thickness of base plate, and circuit carrier soldered with thickened portion by solder

Christian Steininger; Andreas Lenniger

Archive | 2012

Halbleiteranordnung mit plattierter Basisplatte A semiconductor device comprising plated base plate

Olaf Hohlfeld; Andreas Lenniger; Andre Uhlemann

Archive | 2011

Method for producing a solder stop barrier

Andreas Lenniger

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Collaboration

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Olaf Hohlfeld

Infineon Technologies

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Andre Uhlemann

Infineon Technologies

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Elmar Kühle

Infineon Technologies

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Dirk Siepe

Infineon Technologies

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Reinhold Bayerer

Infineon Technologies

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Christian Steininger

Infineon Technologies

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