Is this you? Create Your Porfile
Avatar

Olaf Hohlfeld

Infineon Technologies

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Olaf Hohlfeld is active.

Explore More

Publication

Featured researches published by Olaf Hohlfeld.

Archive | 2008

MODULE INCLUDING A ROUGH SOLDER JOINT

Olaf Hohlfeld; Reinhold Bayerer

Archive | 2013

Semiconductor device including cladded base plate

Andreas Lenniger; Andre Uhlemann; Olaf Hohlfeld

Archive | 2010

POWER SEMICONDUCTOR MODULE FEATURING RESILIENTLY SUPPORTED SUBSTRATES AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR MODULE

Peter Kanschat; Olaf Hohlfeld; Thilo Stolze

Archive | 2010

Power Semiconductor Module Including Substrates Spaced from Each Other

Thilo Stolze; Olaf Hohlfeld; Peter Kanschat

Archive | 2009

Modul mit stabiler Lötverbindung

Reinhold Bayerer; Jens Goerlich; Karsten Guth; Olaf Hohlfeld

Archive | 2013

Semiconductor device includes semiconductor chip that includes upper and lower contact plates which are integrally connected to upper chip metallization and lower chip metallization by upper and lower connecting layers

Olaf Hohlfeld

Archive | 2011

Power semiconductor module, has power semiconductor chip arranged on substrate, and heat sink contacting substrate directly and made of plastic-based injection molding compound that exhibits specific heat conductivity

Olaf Hohlfeld

Archive | 2010

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

Olaf Hohlfeld; Jens Goerlich; Reinhold Bayerer

Archive | 2010

Power Semiconductor Module, Power Semiconductor Module Assembly and Method for Fabricating a Power Semiconductor Module Assembly

Reinhold Bayerer; Olaf Hohlfeld; Thilo Stolze

Archive | 2009

Circuit supporting arrangement producing method for producing e.g. inverter module used in industrial application, involves soldering metal surface, lower metalized layer and fastening structure using brazing solder

Reinhold Bayerer; Jens Goerlich; Olaf Hohlfeld

Explore More

Collaboration

Dive into the Olaf Hohlfeld's collaboration.

Top Co-Authors
Avatar

Reinhold Bayerer

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Peter Kanschat

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Gottfried Beer

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Thilo Stolze

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Jürgen Högerl

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Edward Fuergut

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Juergen Hoegerl

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Andreas Lenniger

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Guido Boenig

Infineon Technologies

View shared research outputs
Top Co-Authors
Avatar

Jens Goerlich

Infineon Technologies

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge