Andrew Aragon

Electrical and microstructure analysis of nickel-based low-resistance ohmic contacts to n-GaSb

Ultra low resistance ohmic contacts are fabricated on n-GaSb grown by molecular beam epitaxy. Different doping concentrations and n-GaSb thicknesses are studied to understand the tunneling transport mechanism between the metal contacts and the semiconductor. Different contact metallization and anneal process windows are investigated to achieve optimal penetration depth of Au in GaSb for low resistances. The fabrication, electrical characterization, and microstructure analysis of the metal-semiconductor interfaces created during ohmic contact formation are discussed. The characterization techniques include cross-sectional transmission electron microscopy and energy dispersive spectroscopy. Specific transfer resistances down to 0.1 Ω mm and specific contact resistances of 1 × 10−6 Ω cm2 are observed.

High-Speed Nonpolar InGaN/GaN LEDs for Visible-Light Communication

Free-standing nonpolar GaN substrates provide an excellent platform for the fabrication of high-speed blue and green light-emitting diodes (LEDs), which are attractive for visible-light communication, plastic optical fiber communication, and short-range under water optical communication. Nonpolar LEDs on free-standing GaN exhibit a large electron-hole wave function overlap, low extended defect density, and favorable thermal properties. Here, we demonstrate high-speed nonpolar InGaN/GaN LEDs with a peak emission wavelength between 455 and 465 nm on free-standing nonpolar GaN substrates. A large frequency modulation bandwidth of 524 MHz is demonstrated at a current density of 10 kA/cm 2 .

Explanation of low efficiency droop in semipolar (202¯1¯) InGaN/GaN LEDs through evaluation of carrier recombination coefficients

We report the carrier dynamics and recombination coefficients in single-quantum-well semipolar (202¯1¯) InGaN/GaN light-emitting diodes emitting at 440 nm with 93% peak internal quantum efficiency. The differential carrier lifetime is analyzed for various injection current densities from 5 A/cm2 to 10 kA/cm2, and the corresponding carrier densities are obtained. The coupling of internal quantum efficiency and differential carrier lifetime vs injected carrier density (n) enables the separation of the radiative and nonradiative recombination lifetimes and the extraction of the Shockley-Read-Hall (SRH) nonradiative (A), radiative (B), and Auger (C) recombination coefficients and their n-dependency considering the saturation of the SRH recombination rate and phase-space filling. The results indicate a three to four-fold higher A and a nearly two-fold higher B0 for this semipolar orientation compared to that of c-plane reported using a similar approach [A. David and M. J. Grundmann, Appl. Phys. Lett. 96, 103504 (2010)]. In addition, the carrier density in semipolar (202¯1¯) is found to be lower than the carrier density in c-plane for a given current density, which is important for suppressing efficiency droop. The semipolar LED also shows a two-fold lower C0 compared to c-plane, which is consistent with the lower relative efficiency droop for the semipolar LED (57% vs. 69%). The lower carrier density, higher B0 coefficient, and lower C0 (Auger) coefficient are directly responsible for the high efficiency and low efficiency droop reported in semipolar (202¯1¯) LEDs.

Differential carrier lifetime and transport effects in electrically injected III-nitride light-emitting diodes

This work describes a small-signal microwave method for determining the differential carrier lifetime and transport effects in electrically injected InGaN/GaN light-emitting diodes (LEDs). By considering the carrier diffusion, capture, thermionic escape, and recombination, the rate equations are used to derive an equivalent small-signal electrical circuit for the LEDs, from which expressions for the input impedance and modulation response are obtained. The expressions are simultaneously fit to the experimental data for the input impedance and modulation response for nonpolar InGaN/GaN micro-LEDs on free-standing GaN substrates. The fittings are used to extract the transport related circuit parameters and differential carrier lifetimes. The dependence of the parameters on the device diameter and current density is reported. We also derive approximations for the modulation response under low and high injection levels and show that the transport of carriers affects the modulation response of the device, espe...

Transmission Electron Microscopy-Based Analysis of Electrically Conductive Surface Defects in Large Area GaSb Homoepitaxial Diodes Grown Using Molecular Beam Epitaxy

We investigate a mechanism causing shorting of large area GaSb diodes grown on GaSb substrates using molecular beam epitaxy (MBE). The source of these shorts is determined to be large crystallographic defects on the surface of the diodes that are formed around droplets of gallium ejected from the gallium Knudsen cells during MBE. The gallium droplets cause defects in the crystal structure, and, as the epitaxy continues, the gallium is incorporated into the surrounding material. The shape of the defects is pyramidal with a central void extending from the epi-surface to the gallium core. Processing a GaSb diode with these surface defects results in the top-side contact metal migrating into the defect and shorting the diode. This prevents realization of large area diodes that are critical to applications such as photovoltaics and detectors. The diodes in this study are electrically characterized and the defect formation mechanism is investigated using cross-section transmission electron microscopy and electron dispersive spectroscopy.

Ohmic contacts to n-type GaSb grown on GaAs by the interfacial misfit dislocation technique

Low resistance ohmic contacts have been successfully fabricated on n-GaSb layers grown by MBE on semi-insulating (SI) GaAs substrates using the Interfacial Misfit Dislocation (IMF) technique. Although intended for photovoltaic applications, the results are applicable to many antimonide-based devices. The IMF technique enables the growth of epitaxial GaSb layers on semi-insulating GaAs substrates resulting in vertical current confinement not possible on unintentionally doped ~ 1e17 cm-3 p-doped bulk GaSb. Results for low resistance ohmic contacts using NiGeAu, PdGeAu, GeAuNi and GeAuPd metallizations for various temperatures are reported. Specific transfer resistances down to 0.12 Ω-mm and specific contact resistances of < 2e-6 Ω-cm2 have been observed.

Impact of crystal orientation on the modulation bandwidth of InGaN/GaN light-emitting diodes

High-speed InGaN/GaN blue light-emitting diodes (LEDs) are needed for future gigabit-per-second visible-light communication systems. Large LED modulation bandwidths are typically achieved at high current densities, with reports close to 1 GHz bandwidth at current densities ranging from 5 to 10 kA/cm2. However, the internal quantum efficiency (IQE) of InGaN/GaN LEDs is quite low at high current densities due to the well-known efficiency droop phenomenon. Here, we show experimentally that nonpolar and semipolar orientations of GaN enable higher modulation bandwidths at low current densities where the IQE is expected to be higher and power dissipation is lower. We experimentally compare the modulation bandwidth vs. current density for LEDs on nonpolar (101¯0), semipolar (202¯1¯), and polar 0001 orientations. In agreement with wavefunction overlap considerations, the experimental results indicate a higher modulation bandwidth for the nonpolar and semipolar LEDs, especially at relatively low current densities....

Characterization of surface defects on Be-implanted GaSb

Characteristics of ion implantation induced damage in GaSb, and its removal by rapid thermal annealing, are investigated by cross-sectional transmission electron microscopy. Rapid thermal annealing (RTA) has been implemented on implanted GaSb for various temperatures and durations with the semiconductor capped, which avoids Sb out-diffusion and Ga agglomeration during the process. The RTA damage induced in the GaSb wafer was studied by scanning electron microscopy and energy dispersive x-ray spectroscopy. The results of the microscopy study were then used to optimize the RTA recipe and the Si3N4 capping layer thickness to achieve doping activation while minimizing crystalline damage. Results indicate a lattice quality that is close to pristine GaSb for samples annealed at 600 °C for 10 s using 260 nm thick Si3N4 capping layer. Secondary ion mass spectrometry measurement indicates that the implanted Be does not migrate in the GaSb at the used annealing temperature. Finally, electrical characteristics of di...

Low resistance palladium/molybdenum based ohmic contacts to n-GaSb grown on GaAs

Low resistance ohmic contacts were fabricated on n-type GaSb grown by molecular beam epitaxy. N-type GaSb epilayers with different doping concentrations and thicknesses were fabricated and studied in order to investigate the current transport mechanism between the metal contacts and the semiconductor. Different metallization schemes were implemented to achieve the lowest possible contact resistance. Rapid thermal annealing was performed at various temperatures to achieve the optimal gold penetration into the GaSb epilayers for low resistance. Ohmic contact fabrication and electrical characterization are discussed in detail. The microstructure analysis of the semiconductor and metal contact interfaces was performed using cross-section transmission electron microscopy and energy dispersive spectroscopy. Specific contact resistances as low as 3 × 10−6 Ω cm2 were obtained.

Ultra-low resistance NiGeAu and PdGeAu ohmic contacts on N-GaSb grown on GaAs

Ultra-low resistance ohmic contacts on n-GaSb with specific transfer resistances down to 0.12 Ω-mm and specific contact resistances of ~1.1e-6 Ω-cm2 have been successfully fabricated on semi-insulating (SI) GaAs substrates using the Interfacial Misfit Dislocation (IMF) technique. The IMF technique enables epitaxial growth of GaSb layers on semi-insulating GaAs substrates resulting in vertical current confinement not possible on unintentionally ~ 1e17 cm-3 p-doped bulk GaSb. Results for low resistance ohmic contacts using NiGeAu, PdGeAu, GeAuNi and GeAuPd metallizations for various temperatures are reported. The low annealing temperature of NiGeAu and PdGeAu metallizations show promising results, but the lifetime of a device with these contacts have not yet been studied.