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Dive into the research topics where Andrew Edwards is active.

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Featured researches published by Andrew Edwards.


international symposium on power semiconductor devices and ic's | 2013

Vertical power diodes in bulk GaN

Don Disney; Hui Nie; Andrew Edwards; David Bour; Hemal Shah; Isik C. Kizilyalli

Vertical diodes with breakdown voltages up to 2.6kV have been fabricated on bulk GaN substrates. The measured figures-of-merit of these devices show performance near the theoretical limit of GaN. These vertical GaN diodes exhibit robust avalanche breakdown behavior with a positive temperature coefficient. System-level performance advantages have been demonstrated in power conversion applications. Statistical data have been collected from thousands of devices. Initial reliability tests have been completed.


Tetrahedron | 1998

Cycloadditions and nucleophilic attack on Z-2H-heptafluorobut-2-ene

Richard D. Chambers; Andrew Edwards

Abstract Chemistry of Z-2H-Heptafluorobut-2-ene 1 is surveyed; cycloaddition reactions occur with a variety of benzenoid compounds, in some cases leading directly to aromatics. Addition to cyclopentadiene, followed by eliminations of hydrogen fluoride and ethyne, lead to isomeric bistrifluoromethylcyclopentadienes. Nucleophilic reactions occur readily with oxygen, nitrogen and sulphur nucleophiles and aniline provides a quinoline synthesis.


radio frequency integrated circuits symposium | 2008

A broadband low cost GaN-on-silicon MMIC amplifier

Bernard Geller; Allen W. Hanson; A. Chaudhari; Andrew Edwards; Isik C. Kizilyalli

The design and performance of a 0.1 to 5 GHz medium power distributed amplifier is described. The circuit is realized using a low-cost GaN-on-silicon MMIC process featuring 0.5 mum gate length GaN HFETs on a 150 mum thick high resistivity silicon substrate. The circuit was designed using a non-linear FET model and standard passive component models. The first pass circuit demonstrates a saturated output power of 2 W and a maximum efficiency of greater than 30% at 1 GHz at a drain bias of 15 V, and a saturated output power of 3 W and maximum efficiency of 23% at 2.5 GHz with a drain bias of 28 V.


Journal of Fluorine Chemistry | 1998

AMBIDENT NUCLEOPHILIC ADDITION TO ETHYL TRIFLUOROMETHYLACETOACETATE

Richard D. Chambers; Andrew Edwards; Andrei S. Batsanov; Judith A. K. Howard

Abstract Reaction between hydroxylamine (1) and ethyl trifluoromethylacetoacetate (2) is reported. A crystal structure of the resultant isoxazolidin-3-one (3) was obtained.


Journal of The Chemical Society-perkin Transactions 1 | 1997

Perfluorocarbon fluids as solvent replacements

Richard D. Chambers; Andrew Edwards

Perfluoroperhydrophenanthrene 1 may be used as a ‘bulking agent’ to minimise the problem of solvent recovery in halogen exchange (‘Halex’) reactions for the preparation of octafluorocyclopentene 8, and chlorofluoro-pyridine, -pyrimidine and -benzene derivatives. New ‘one-pot’ procedures for the syntheses of hexafluorobut-2-yne 3, octafluorobut-2-ene 11 and hexafluorocyclobutene 7 are described.


international microwave symposium | 2007

A Comparison of AlGaN/GaN HFETs on Si Substrates in Ceramic Air Cavity and Plastic Overmold Packages

Robert Joseph Therrien; A. Chaudhari; Sameer Singhal; C. Snow; Andrew Edwards; C. Park; W. Nagy; J. W. Johnson; Allen W. Hanson; Kevin J. Linthicum; Isik C. Kizilyalli

AlGaN/GaN HFETs on Si substrates have been assembled in ceramic air cavity and plastic overmold packages. Thermal, DC, small and large signal RF and reliability characterization have been performed on both types of devices. Thermal characterization shows that the thermal resistance of the plastic overmolded parts is higher resulting in higher operating temperatures. The higher operating temperature causes parameters such as the peak CW power to be lower than that seen in the ceramic air cavity package. The advantage of the plastic packaging resides in its >10x lower package assembly cost.


compound semiconductor integrated circuit symposium | 2007

High-Power and High-Voltage AlGaN/GaN HEMTs-on-Si

Chris Park; Andrew Edwards; Pradeep Rajagopal; Wayne Johnson; Sameer Singhal; Allen W. Hanson; Quinn Martin; Edwin L. Piner; Kevin J. Linthicum; Isik C. Kizilyalli

GaN-on-Silicon technology is a highly manufacturable, reliable, and cost effective AlGaN/GaN HEMT platform. Maximum RF performance (power and efficiency) can be achieved by addressing two main areas related to the silicon substrate: the RF loss to the silicon substrate and the thermal resistance of the device to the heat sink. In this paper, we will report on how the two areas can be addressed in a realistic environment to enable high power, high voltage operation. This device technology can be used to develop high power amplifiers that are significantly smaller, lighter, and operate over a broad bandwidth.


Archive | 2011

METHOD AND SYSTEM FOR FLOATING GUARD RINGS IN GAN MATERIALS

Andrew Edwards; Hui Nie; Isik C. Kizilyalli; Richard J. Brown; David P. Bour; Linda T. Romano; Thomas R. Prunty


Archive | 2011

Fabrication of floating guard rings using selective regrowth

Linda T. Romano; David P. Bour; Andrew Edwards; Hui Nie; Isik C. Kizilyalli; Richard J. Brown; Thomas R. Prunty


MRS Proceedings | 2008

GaN-on-Si HEMTs: From Device Technology to Product Insertion

Wayne Johnson; Sameer Singhal; Allen W. Hanson; Robert Joseph Therrien; A. Chaudhari; W. Nagy; Pradeep Rajagopal; Quinn Martin; Todd Nichols; Andrew Edwards; John Roberts; Edwin L. Piner; Isik C. Kizilyalli; Kevin J. Linthicum

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Isik C. Kizilyalli

University of Illinois at Urbana–Champaign

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