Andrew J. Trunek

Growth of step-free surfaces on device-size (0001)SiC mesas

It is believed that atomic-scale surface steps cause defects in single-crystal films grown heteroepitaxially on SiC substrates. A method is described whereby surface steps can be grown out of existence on arrays of device-size mesas on commercial “on-axis” SiC wafers. Step-free mesas with dimensions up to 200 μm square have been produced on 4H-SiC wafers and up to 50 μm square on a 6H-SiC wafer. A limiting factor in scaling up the size and yield of the step-free mesas is the density of screw dislocations in the SiC wafers. The fundamental significance of this work is that it demonstrates that two-dimensional nucleation of SiC can be suppressed while carrying out step-flow growth on (0001)SiC. The application of this method should enable the realization of improved heteroepitaxially-grown SiC and GaN device structures.It is believed that atomic-scale surface steps cause defects in single-crystal films grown heteroepitaxially on SiC substrates. A method is described whereby surface steps can be grown out of existence on arrays of device-size mesas on commercial “on-axis” SiC wafers. Step-free mesas with dimensions up to 200 μm square have been produced on 4H-SiC wafers and up to 50 μm square on a 6H-SiC wafer. A limiting factor in scaling up the size and yield of the step-free mesas is the density of screw dislocations in the SiC wafers. The fundamental significance of this work is that it demonstrates that two-dimensional nucleation of SiC can be suppressed while carrying out step-flow growth on (0001)SiC. The application of this method should enable the realization of improved heteroepitaxially-grown SiC and GaN device structures.

Electron channeling contrast imaging of atomic steps and threading dislocations in 4H-SiC

Direct imaging of atomic step morphologies and individual threading dislocations in on-axis epitaxial 4H-SiC surfaces is presented. Topographically sensitive electron images of the crystalline surfaces were obtained through forescattered electron detection inside a conventional scanning electron microscope. This technique, termed electron channeling contrast imaging (ECCI), has been utilized to reveal the configuration of highly stepped, homoepitaxial 4H-SiC films grown on 4H-SiC mesa structures. Individual threading dislocations have been consistently imaged at the core of spiral atomic step morphologies located on the 4H-SiC surfaces. The ability of ECCI to image atomic steps was verified by atomic force microscopy.

Nondestructive analysis of threading dislocations in GaN by electron channeling contrast imaging

Threading dislocations in metal-organic chemical-vapor grown GaN films were imaged nondestructively by the electron channeling contrast imaging (ECCI) technique. Comparisons between ECCI and cross-sectional transmission electron microscopy indicated that pure edge dislocations can be imaged in GaN by ECCI. Total threading dislocation densities were measured by ECCI for various GaN films on engineered 4H-SiC surfaces and ranged from 107to109cm−2. A comparison between the ultraviolet electroluminescent output measured at 380nm and the total dislocation density as measured by ECCI revealed an inverse logarithmic dependence.

Enlargement of Step-Free SiC Surfaces by Homoepitaxial Web-Growth of Thin SiC Cantilevers

Lateral homoepitaxial growth of thin cantilevers emanating from mesa patterns that were reactive ion etched into on-axis commercial SiC substrates prior to growth is reported. The thin cantilevers form after pure stepflow growth removes almost all atomic steps from the top surface of a mesa, after which additional adatoms collected by the large step-free surface migrate to the mesa sidewall where they rapidly incorporate into the crystal near the top of the mesa sidewall. The lateral propagation of the step-free cantilevered surface is significantly affected by pregrowth mesa shape and orientation, with the highest lateral expansion rates observed at the inside concave corners of V-shaped pregrowth mesas with arms lengthwise oriented along the 〈1100〉 direction. Complete spanning of the interiors of V’s and other mesa shapes with concave corners by webbed cantilevers was accomplished. Optical microscopy, synchrotron white beam x-ray topography and atomic force microscopy analysis of webbed regions formed ...

Lowered dislocation densities in uniform GaN layers grown on step-free (0001) 4H-SiC mesa surfaces

We report that very low threading dislocation densities (8×107∕cm2) were achieved in uniform GaN layers grown by metalorganic chemical vapor deposition on (0001) 4H-SiC mesa surfaces 50μm×50μm in area that were completely free of steps. Transmission electron microscopy (TEM) indicated that all observable GaN film threading dislocations were of edge type. TEM analysis of the defect structure of the nucleation layer (aluminum nitride, AlN) revealed a lack of c-component dislocations, and the clean annihilation of lateral, a-type dislocations within the first 200 nm of growth, with no lateral dislocations developing threading arms. These results indicate that the elimination of steps on the initial (0001) 4H-SiC growth surface may play an important role in the removal of mixed and c-type dislocations in subsequently grown AlN and GaN heteroepitaxial layers.

Improved ultraviolet emission from reduced defect gallium nitride homojunctions grown on step-free 4H-SiC mesas

We previously reported 100-fold reductions in III-N heterofilm threading dislocation density achieved via growth on top of (0001) 4H-SiC mesas completely free of atomic scale steps. This letter compares the electroluminescent (EL) output of GaN pn junctions grown on top of 4H-SiC mesas with and without such steps. An average of 49% enhancement of the ultraviolet luminescence (380nm) was observed in step-free mesas over comparable “stepped” counterparts. Despite the intense EL from the step-free devices, significant leakage was observed through the periphery of the device, possibly due to the lack of GaN junction isolation processing.

Microstructure of heteroepitaxial GaN grown on mesa-patterned 4H-SiC substrates

Cross-sectional transmission electron microscopy and atomic force microscopy have been used to study the microstructure of a thin heteroeptiaxial GaN film grown on (0001) 4H-SiC mesa surfaces with and without atomic scale steps. Analysis of a mesa that was completely free of atomic-scale surface steps prior to III–N film deposition showed that these GaN layers had a wide variation in island height (1–3μm) and included the presence of pit-like defects on the film surface. This sample had a low dislocation density (5×108∕cm2) as compared to conventionally grown samples on unpatterned (0001) on-axis 4H-SiC (2×109∕cm2), coupled with a 3–5 times increase in grain size. A comparison of a GaN film on the step-free 4H-SiC mesa region with a GaN film on a stepped 4H-SiC mesa region on the same substrate showed that the presence of surface steps reduced the overall grain size of the film from 7–10μm to a grain size of about 2–3μm. Since the GaN films grow via a Volmer–Weber mechanism, a decrease in the number of he...

Growth and characterization of 3C?SiC and 2H?AlN/GaN films and devices produced on step-free 4H?SiC mesa substrates

While previously published experimental results have shown that the step-free (0?0?0?1) 4H?SiC mesa growth surface uniquely enables radical improvement of 3C?SiC and 2H?AlN/GaN heteroepitaxial film quality (>100-fold reduction in extended defect densities), important aspects of the step-free mesa heterofilm growth processes and resulting electronic device benefits remain to be more fully elucidated. This paper reviews and updates recent ongoing studies of 3C?SiC and 2H?AlN/GaN heteroepilayers grown on top of 4H?SiC mesas. For both 3C?SiC and AlN/GaN films nucleated on 4H?SiC mesas rendered completely free of atomic-scale surface steps, TEM studies reveal that relaxation of heterofilm strain arising from in-plane film/substrate lattice constant mismatch occurs in a remarkably benign manner that avoids formation of threading dislocations in the heteroepilayer. In particular, relaxation appears to occur via nucleation and inward lateral glide of near-interfacial dislocation half-loops from the mesa sidewalls. Preliminary studies of homojunction diodes implemented in 3C-SiC and AlN/GaN heterolayers demonstrate improved electrical performance compared with much more defective heterofilms grown on neighbouring stepped 4H?SiC mesas. Recombination-enhanced dislocation motion known to degrade forward-biased 4H?SiC bipolar diodes has been completely absent from our initial studies of 3C?SiC diodes, including diodes implemented on defective 3C?SiC heterolayers grown on stepped 4H?SiC mesas.

Hydrogen Gas Sensors Fabricated on Atomically Flat 4H-SiC Webbed Cantilevers

This paper reports on initial results from the first device tested of a “second generation” Pt-SiC Schottky diode hydrogen gas sensor that: 1) resides on the top of atomically flat 4H-SiC webbed cantilevers, 2) has integrated heater resistor, and 3) is bonded and packaged. With proper selection of heater resistor and sensor diode biases, rapid detection of H2 down to concentrations of 20 ppm was achieved. A stable sensor current gain of 125 ± 11 standard deviation was demonstrated during 250 hours of cyclic test exposures to 0.5% H2 and N2/air.

Step Free Surface Heteroepitaxy of 3C-SiC Layers on Patterned 4H/6H-SiC Mesas and Cantilevers

Most SiC devices are implemented in homoepitaxial films grown on 4H/6H-SiC wafers with surfaces 3 degrees to 8 degrees off-axis from the (0001) basal plane. This approach has not prevented many substrate crystal defects from propagating into SiC epilayers, and does not permit the realization of SiC heteropolytype devices. This presentation describes recent advances in SiC epitaxial growth that begun to overcome the above shortcomings for arrays of mesas patterned into on-axis 4H/6H-SiC wafers. First, we demonstrated that atomic-scale surface steps can be completely eliminated from 4H/6H-SiC mesas via on-axis homoepitaxial step-flow growth, forming (0001) basal plane surfaces (up to 0.4 mm x 0.4 mm) for larger than previously thought possible. Step-free surface areas were then extended by growth fo thin lateral cantilevers from the mesa tops. These lateral cantilevers enabled substrate defects to be reduced and relocated in homoepitaxial films in a manner not possible with off-axis SiC growth. Finally, growth of vastly improved 3C-SiC heterofilms was achieved on 4H/6H-SiC mesas using the recently develop step-free surface heteroepitaxy process. These epitaxial growth developments should enable improved homojunction and heterojunction silicon carbide prototype devices.